Industry News

HBM demand soars as Samsung, SK Hynix invest over 2 trillion won in aggressive production expansion

Views : 11
Update time : 2023-08-03 14:10:34
        The rapid development of ChatGPT generative artificial intelligence since last December has increased demand for high-performance DRAM, or high-bandwidth memory (HBM), capable of handling large-scale data, which can increase data capacity and speed by more than ten times compared with conventional DRAM, Businesskorea reported.
 
 
        Industry sources revealed that storage semiconductor companies such as Samsung Electronics and SK Hynix are pushing for the expansion of HBM production lines. The two companies plan to invest more than 2 trillion won by the end of next year to more than double the current capacity of the HBM production line.SK Hynix plans to utilize the unused space in the Cheongju plant after the existing HBM production base in Icheon. Samsung Electronics is considering expanding its core HBM production line in Cheonan, Chungcheongnam-do, which is home to the advanced packaging team under the Device Solutions division. 
        Demand for HBM in gigabytes (GB) is expected to surge by 60 percent from 181 million GB in 2022 to 290 million GB in 2023, market research firm TrendForce said. it is projected to increase by another 30 percent in 2024 compared to 2023. 
        The latest "HBM3" is understood to have a total capacity of 12 times that of the latest DRAM product, GDDR6, and about 13 times the bandwidth.According to the report, customers and HBM manufacturers usually discuss product development for more than a year and produce customized products. NVIDIA recently received HBM2E and HBM3 from SK Hynix, which were also jointly developed 1-2 years ago. 
        HBM is thawing the memory semiconductor market. While Samsung and SK Hynix have yet to reveal specific HBM pricing, the latest 4th generation product, HBM3, is said to be about 5-6 times the price of the latest legacy DRAMs. That's why HBM shipments this year accounted for only 1.7% of total DRAM shipments, but the proportion of its sales reached 11%. 
        However, to become a real "cash cow", the industry pointed out that they need to further increase HBM production and reduce production costs. A professor of semiconductor research at a metropolitan area university said, "The more DRAMs are stacked, the lower the yield and the higher the cost," and "they must also overcome the limitations of 'generative AI servers' as the only source of demand. The more cascading DRAMs, the lower the yield and the higher the cost," and "they also have to overcome the limitations of 'generative AI servers' as the sole source of demand.

 
Related News
Read More >>
How many chips does a car need? How many chips does a car need?
Sep .19.2024
Automotive chips can be divided into four types according to their functions: control (MCU and AI chips), power, sensors, and others (such as memory). The market is monopolized by international giants. The automotive chips people often talk about refer to
Position and Function of Main Automotive Sensors Position and Function of Main Automotive Sensors
Sep .18.2024
The function of the air flow sensor is to convert the amount of air inhaled into the engine into an electrical signal and provide it to the electronic control unit (ECU). It is the main basis for determining the basic fuel injection volume. Vane type: The
Chip: The increasingly intelligent electronic brain Chip: The increasingly intelligent electronic brain
Sep .14.2024
In this era of rapid technological development, we often marvel at how mobile phones can run various application software smoothly, how online classes can be free of lag and achieve zero latency, and how the functions of electronic devices are becoming mo
LDA100 Optocoupler: Outstanding Performance, Wide Applications LDA100 Optocoupler: Outstanding Performance, Wide Applications
Sep .13.2024
In terms of characteristics, LDA100 is outstanding. It offers AC and DC input versions for optional selection, enabling it to work stably in different power supply environments. The small 6-pin DIP package not only saves space but also facilitates install