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NVIDIA, AMD AI chips to produce 1.5 million this year, advanced packaging equipment vendors benefit

Update time : 2024-01-15 14:20:18

NVIDIA, AMD in 2024 to continue to sprint artificial intelligence (AI) gas pedal market, it is expected that the two will jointly order about 1.5 million advanced AI chips to TSMC, making TSMC advanced packaging capacity performance strong. Investment institutions predicted that China and Taiwan's Hong plastic, Xinwei, titanium rising, Wanrun and other advanced packaging equipment manufacturers, this year's shipment momentum is expected to increase quarter by quarter.

Previously reported, NVIDIA's top AI chip is currently in addition to H200, GH200, 2024 will also be released in the next generation of architecture B100, GB200 and other new products. AMD this year's main AI gas pedal MI300A, MI300X, etc., the current product has been shipped, a number of large factories to take the order, on behalf of the AMD this year, will begin to sprint shipments of kinetic energy. China Taiwan industry analysis, if TSMC capacity to give more support, AMD in the AI accelerator chip annual shipment momentum is expected to reach 600,000 pcs.
In response to NVIDIA and AMD's strong demand for advanced packaging, TSMC will continue to expand CoWoS and other advanced packaging production capacity, so investment institutions are optimistic about the package responsible for the wet process equipment Hong Plastic and XinWei, Titanium Sheng Technology's plasma and laser equipment, Mason's dispenser, AOI and planted heat sink compression and other related advanced packaging equipment concept stocks, 2024 shipments are expected to be prosperous season by season.

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