DENSO and UMC's Japanese subsidiary achieve mass production shipment of 12-inch IGBT wafers
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Update time : 2023-05-15 11:44:29
DENSO Corporation, a Japanese automotive electronics supplier, and USJC, a Japanese subsidiary of foundry major UMC, held a mass production shipment ceremony for 12-inch IGBTs at USJC's fab in Mie Prefecture, Japan, on May 10. The two companies jointly announced that the insulated gate bipolar transistors (IGBTs) jointly produced by the two companies have entered mass production at USJC's 12-inch fab. This is the first shipment ceremony to mark this important milestone following the strategic partnership between the two companies on key power semiconductors for electric vehicles in 2022.
UMC pointed out that with the rapid popularity of electric vehicles, automakers are seeking to improve powertrain efficiency while also taking into account the cost effectiveness of electric vehicles. The two collaborations are expected to produce 10,000 wafers of IGBTs per month by 2025. Koji Arima, President of DENSO, said, "It is a pleasure to participate in the shipment celebration today and witness the solid partnership between DENSO, UMC and USJC. We come from different corporate cultures, such as the semiconductor industry and the automotive industry. However, we work steadily with mutual respect, which is the source of our strong competitiveness. Looking ahead, DENSO will continue to work with trusted partners to further accelerate the electronicization of mobility by contributing to the semiconductor supply chain, and continue to meet the challenges for the mission of protecting the global environment and creating a society full of smiles." Tomoyuki Kono, General Manager of USJC, said, "USJC is proud to be the first fab in Japan to manufacture IGBTs on 12-inch wafers, offering higher productivity than if they were produced on 8-inch wafers. Thanks to USJC's dedicated team and support from DENSO, we were able to complete our pilot production and reliability testing on schedule and start mass production on time as agreed with our customers." UMC's Co-General Manager, Mr. Wang Shi, noted, "UMC is proud to be a strategic partner of DENSO, a leader in automotive solutions. This partnership showcases UMC's manufacturing capabilities and close collaboration model to ensure customer success. Driven by the trend of automotive electronics and autonomous driving, the content of automotive ICs is expected to continue to increase, especially for products using special processes of 28nm and above. As a leader in special process, UMC is ready to play a more important role in the automotive value chain and assist our partners to seize the moment and win market share in this fast growing industry."
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