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Infineon AIROC™ CYW20829 low-power Bluetooth System-on-Chip supports the latest Bluetooth 5.4 specification

Update time : 2023-05-02 13:44:37

Infineon Technologies AG has announced that the AIROC™ CYW20829 low-power Bluetooth system-on-chip (SoC) will support the latest Bluetooth 5.4 specification. With its combination of low power consumption and high performance, the AIROC™ CYW20829 supports a complete range of low power Bluetooth (LE) use cases, including smart home, sensors, medical care, lighting, Bluetooth mesh networks, remote control, human-computer interaction devices (mouse, keyboard, virtual reality and game controllers), industrial automation and automotive.

The newly released Bluetooth Core 5.4 specification adds several important features to the existing specification including PAwR (periodic broadcast with response), encrypted broadcast data (EAD), LE GATT security level features, etc. PAwR enables energy-efficient bi-directional communication in large-scale one-to-many or star topologies, and EAD provides a standardised method for secure broadcast of data in advertising packets. A standardised approach.
With PAwR, thousands of electronic shelf labels (ESLs) and sensors supporting the Bluetooth 5.4 specification are able to communicate bi-directionally with a single access point. Communication messages can contain commands, sensor values or other data defined by the application layer. ead enables encrypted data on a star network to be authenticated and decrypted only by devices that have previously shared a session key. the LE GATT security level feature enables devices to identify the security mode and level of all their GATT functions. The combination of these features enables ultra-low power, efficient radio usage and secure star networks to be deployed in large-scale ESL and sensor applications.
With the Infineon AIROC CYW20829 low power Bluetooth SOC, our customers can achieve outstanding RF performance, the latest Bluetooth features, built-in security, rich peripherals and low power consumption in one device," said Shantanu Bhalerao, vice president of Bluetooth product line at Infineon Technologies. This device will enable our customers to enjoy the full benefits of the Bluetooth 5.4 specification and accelerate time-to-market."
The Infineon AIROC CYW20829 chip has an excellent RF link budget in its class, with a built-in integrated power amplifier providing 10 dBm transmit output power and a reception sensitivity of -98 dBm at 1 Mbps for LE and -106 dBm for LE-LR at 125 Kbps. the CYW20829 is a dual-core Arm® M33 semiconductor device, with one M33 core reserved for use as a Bluetooth controller and the other Arm® Cortex-M33 core for use in customer applications. the CPU subsystem provides 256K RAM, an XIP interface for external flash memory, and a rich portfolio of peripherals including CAN to support a variety of applications. Built-in security features include secure boot, secure execution environment, True Random Number Generator (TRNG), eFuse-based hardware acceleration technology for specific key and cryptographic operations, etc.
The AIROC CYW20829 is fully software supported by the ModusToolbox™ development environment. This environment helps developers to accelerate the time-to-market of Bluetooth IoT solutions.
About AIROC wireless connectivity products
Infineon AIROC wireless products include Wi-Fi®, Bluetooth, low-power Bluetooth and combo 2-in-1 chips for Wi-Fi+Bluetooth with more than 1 billion shipments, making them ideal for IoT solutions. The broad portfolio includes a wide range of products with outstanding performance, high reliability and ultra-low power consumption that lead the industry in outstanding performance.
AIROC products feature a common software framework across Android, Linux and RTOS platforms, pre-integrated into Infineon's ModusToolbox™ software and toolkit, allowing developers to bring high-quality, differentiated products to market in a timely manner and within budgetary control.

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