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Infineon introduces 650V CoolMOS™ CFD7A for energy-efficient EV fast charging

Update time : 2023-12-06 10:09:44

The accelerated transition to electric vehicles is driving important innovations in vehicle charging systems, which increasingly require more cost-effective, high-performance power electronics. To this end, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is further expanding its 650 V CoolMOS™ CFD7A product portfolio with the QDPAK package. Compared to the industry-familiar TO247 THD device, the product family in the QDPAK package offers equivalent thermal capability but higher electrical performance, enabling efficient energy utilization in on-board chargers and DC-DC converters.

Efficient and robust electric vehicle charging systems help reduce charging time, reduce vehicle weight, increase design flexibility and lower the total cost of ownership of the vehicle. This new product family complements the existing CoolMOS CFD7A product family with a variety of features and benefits in top- and bottom-cooled packages, and the QDPAK TSC (top-cooled) package enables designers to achieve higher power densities and better PCB space utilization.
The 650 V CoolMOS CFD7A provides several important features to support reliable operation in high voltage applications. With reduced parasitic inductance, the device minimizes electromagnetic interference (EMI), ensuring clear signals and stable performance. The Kelvin source pin improves the accuracy of current detection, ensuring accurate measurements even under harsh conditions. With creepage distances suitable for high-voltage applications, as well as high-current capability of up to 694 W in a 25°C temperature environment and high power dissipation (Ptot) capability, the device is a powerful general-purpose device for a wide range of high-voltage applications.
A new system design using a 650 V CoolMOS CFD7A device based on the QDPAK TSC package will maximize PCB space, double the power density, and enhance thermal management through board-level decoupling. This approach simplifies assembly, avoids board stacking, and reduces the need for connectors, resulting in lower system costs. The power switch reduces thermal resistance by up to 35%, providing high power dissipation that is superior to standard cooling solutions.
This feature overcomes the thermal limitations associated with the use of FR4 PCBs in bottom-cooled SMD designs, significantly improving system performance. The optimized power loop design places the driver in close proximity to the power switch, improving reliability by reducing stray inductance and chip temperature. Taken together, these features help to build a cost-effective, robust, and efficient system that is well suited to meet modern charging needs.
As announced in February 2023, the QDPAK TSC package for high power applications has been registered as a JEDEC standard, driving the widespread adoption of the TSC package in new designs through a unified standard package design and board area. To further accelerate this transition, Infineon will also release additional automotive-grade devices in QDPAK TSC packages for in-car chargers and DC-DC converters in 2024, such as 750 V CoolSiC™ devices and 1200 V CoolSiC™ devices.

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