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Infineon introduces SECORA™ Pay portfolio with 28nm chip technology

Update time : 2023-04-04 12:41:35

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has extended its SECORA™ Pay solution portfolio to 28 nm. The innovative product design enables Infineon to push the limits of payment card technology. In doing so, it also provides the latest technology for a reliable sourcing option for the payment ecosystem in major regional markets. The new product family is the first of its kind in the market to apply leading 28 nm chip technology to embedded non-volatile memory. It is designed to alleviate the semiconductor shortage experienced by the payments industry at mature technology nodes.

The SECORA Pay solution is designed to enable the manufacture and distribution of high-quality dual-interface payment cards, providing the highest level of reliability for seamless payments," said Tolgahan Yildiz, Product Line Leader, Payment Solutions, Infineon Technologies Secure Connected Systems Division. SECORA Pay solutions are designed to enable the manufacture and issuance of high quality dual-interface payment cards, providing high transaction performance and reliable security for trusted, seamless payments." The global dual-interface payment card market is expected to grow at a compound annual growth rate of 6 percent from an estimated 2.6 billion cards in 2022 to 2027.
Infineon's new plug-and-play solution provides payment card manufacturers with an easy path to new customer or ientation and migration. They are backward compatible with existing SECORA Pay products in terms of card manufacturing, antenna design, personalization and product certification. In addition, these devices offer excellent contactless and personalization performance, enabling contactless transactions to be completed in 155 milliseconds.
The new product family features a secure controller with certified software integrated into the Coil Module (CoM) chip. The product family also features standardized inlays for easy and fast card production and compatibility with SECORA Pay products in 65 nm, 40 nm and 28 nm specifications, which can be used in both existing and next-generation SECORA Pay products. Infineon has integrated inductive coupling technology and copper wire card antennas in the CoM system, allowing engineers to design payment cards with extreme flexibility. As a result, the system is well suited to future market trends, such as environmentally friendly payment cards made of recycled materials and marine plastics or wood, as well as high-performance dual-interface metal or LED payment cards.
In addition, the SECORA Pay solution enables the production of stable and very high yield dual-interface payment cards using very few resources in the payment card production process. This makes contactless payment technology inherently resource efficient. New value-added services based on SECORA Pay's NFC tagging capabilities support additional usage scenarios such as initial card activation and identity verification for online banking and loyalty programs.

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