Industry News

Memory Maker to Expand Kaohsiung Plant by NT$1.73 Billion

Views : 246
Update time : 2023-08-09 10:56:04
        According to Taiwan's Business Times, the board of directors of Winbond Electronics approved a NT$1.73 billion capital expenditure budget on August 3, which will be used for the expansion of the Kaohsiung plant, with investments to be made from August onwards.
        According to the management of Winbond Power in the first quarter of the legal conference, the estimated capital expenditure in 2023 is NT$12.1 billion, an annual decrease of 70.34%, most of which will be used for the construction of the Kaohsiung plant and to improve the quality of the process, the research and development of new processes and other expenditures.
        Winbond Electronics planning, Kaohsiung Luzhu plant 20nm products are expected to be mass production in the fourth quarter of 2023, is expected by the end of 2023 to the first quarter of 2024, Kaohsiung plant monthly production capacity of up to 14,000 pieces.
        The corporation pointed out that Winbond's Kaohsiung plant is all 25Snm, and its main products are DDR3 2G and DDR3 4G. The new process DRAM 20nm and Nor Flash 45nm have recently started production and have been handed over to customers for testing. It is estimated that it will take 4 to 6 months for the new products to contribute to the revenue from wafer casting and validation.
        Early in May this year, Winbond's General Manager, Mr. Chen Pei-ming, said that PC factories have reached a healthy level of inventory adjustments, and many commercial PCs and consumer electronics back to replenish inventory of the rush orders are pouring in. It is expected that Winbond's operation will reach the bottom in the first quarter of 2023, and there will be a chance for the operation to be adjusted up in the second quarter. As a result, the company's Taichung plant's capacity utilization rate will increase by 10 percentage points in the second quarter compared to the first quarter, and then maintain the trend of quarterly growth.

        Winbond Electronics revealed that consumer electronics, television, Internet of Things and other three major applications customer demand warmed up, industrial control-related orders also continue to hot, customers rush order influx, and "the amount is not bad", will help the company's revenue.
 
Related News
Read More >>
LDK220 LDO Voltage Regulators Specifications, Features, Pinout, and Applications LDK220 LDO Voltage Regulators Specifications, Features, Pinout, and Applications
Feb .02.2026
The LDK220 series of low-dropout linear regulators (LDOs) is a high-performance device designed specifically for low-power consumption and high-precision voltage regulation, widely used in scenarios such as consumer electronics, industrial control, and po
Xilinx Spartan®-7 FPGA Family: A High-Performance and Energy-Efficient Solution for Mid-Range FPGAs Xilinx Spartan®-7 FPGA Family: A High-Performance and Energy-Efficient Solution for Mid-Range FPGAs
Jan .20.2026
Xilinx Spartan®-7 FPGA Family stands as a defining solution in the mid-range FPGA landscape, blending high performance, energy efficiency, and cost-effectiveness to redefine versatility for industrial, IoT, and consumer electronics applications. Built on
Altera FLEX Series: Architecture, Innovation, and Application Across Four Generations Altera FLEX Series: Architecture, Innovation, and Application Across Four Generations
Jan .07.2026
The Altera FLEX series was more than a lineup of FPGAs—it was a blueprint for how programmable logic devices could evolve to meet diverse market needs. The FLEX 8000 laid the architectural groundwork, the FLEX 10K redefined functionality with embedded mem
LM4765 vs. LM4766: A Comprehensive Comparison of Dual-Channel Audio Power Amplifiers LM4765 vs. LM4766: A Comprehensive Comparison of Dual-Channel Audio Power Amplifiers
Dec .16.2025
Among TI standout offerings, the LM4765 and LM4766 are dual-channel amplifiers designed to cater to diverse audio needs—from compact setups to high-fidelity systems. While sharing the same product lineage, these chips differ significantly in power output,