New 4.5 kV XHP™ 3 IGBT Module Allows Drives to Miniaturize Size and Maximize Efficiency
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Update time : 2024-01-08 10:33:11
There is a clear trend toward smaller IGBT modules for many applications and a shift of complex designs up the chain. In response to the global trend toward miniaturization and integration, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has introduced the 4.5 kV XHP™ 3 IGBT module, which is designed to radically change the landscape for medium-voltage variable frequency drives (MVDs) and transportation applications in two- and three-level topologies using AC voltages of 2,000 V to 3,300 V. The module is designed to enable the use of smaller IGBT modules for a wide range of applications. Transportation applications. The new semiconductor devices will benefit a wide range of applications including large conveyor belts, pumps, high-speed trains, locomotives, and commercial, construction and agricultural vehicles (CAVs).
The XHP series consists of a TRENCHSTOP™ IGBT 4450 A half-bridge IGBT module with an emitter-controlled renewal diode and a 450 A diode half-bridge module with an emitter-controlled E4 diode. The insulation voltage of both modules has been increased to 10.4 kV. This pairing helps to simplify paralleling and reduce size without sacrificing efficiency. Previously, paralleling switching modules required complex busbars, which complicated design work and increased inductance. the XHP series has an innovative design that simplifies paralleling by placing the modules side-by-side, which also allows the modules to be paralleled with a single DC busbar. The 4.5 kV XHP series also enables developers to reduce the number of components used during the design process. While traditional IGBT solutions for 3-level solutions have multiple single IGBT switches and a half-bridge diode, designs using the new devices require only two half-bridge switches and a smaller half-bridge diode, which is a significant advancement in drive integration. The combination of the FF450R45T3E4_B5 dual switch and the DD450S45T3E4_B5 dual diode provides significant cost savings and reduces the board footprint. For example, Infineon's previous IGBT solutions required four 140 x 190 mm² or 140 x 130 mm² switches and a 140 x 130 mm² double diode. The new XHP series reduces the number of required components to two 140 x 100 mm² dual switches and a smaller 140 x 100 mm² dual diode.
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