Renesas Electronics announces partnership with AMD to demonstrate complete RF and digital front-end designs for 5G active antenna systems
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Update time : 2023-02-22 13:40:34
Renesas Electronics, a global semiconductor solutions provider, today announced that it will work with AMD to demonstrate a complete RF front-end solution for 5G active antenna system (AAS) radios. The new RF front-end is paired with the field-proven AMD Zynq UltraScale+ RFSoC digital front-end OpenRAN radio (O-RU) reference design, which includes RF switches, low-noise amplifiers, and pre-drivers, providing a complete solution to meet the growing market demand for mobile network infrastructure. The reference platform will be demonstrated at the AMD booth at Mobile World Congress in Barcelona, Spain, from February 27 to March 2.
The new 5G design platform integrates all the essential RF and digital front-end hardware for base stations operating in the Open Radio Access Network (O-RAN) ecosystem, including a highly isolated multi-throw DPD (digital pre-distortion) switch, a high gain and linearity pre-driver in a compact package, an integrated switch, and a low noise amplifier (LNA) with input signal coupling. This complete RF front-end platform is designed to efficiently process and transmit data to wireless networks at optimised power levels. It is also integrated with the AMD RFSoC DFE ZCU670 evaluation kit for rapid prototyping and rapid development of wireless networking systems. This platform delivers superior RF performance while minimising DPD resources for TX channel linearisation, improving radio efficiency and ultimately reducing operational costs for wireless network providers. This RF front-end solution is the latest 5G solution jointly developed by Renesas and AMD. Previously, the two companies collaborated on a high performance RF timing solution for 5G Next Generation Radio (5G NR), which incorporates Renesas' IEEE1588-enabled system synchroniser as part of the DFE ZCU670 evaluation kit. Renesas is proud to join forces with AMD once again to showcase our latest RF technology at the upcoming Mobile World Congress," said Naveen Yanduru, Vice President, RF Communications, Industrial & Communications Division, Renesas Electronics. With our turnkey hardware solution, developers of 5G RF wireless infrastructure systems will be able to reduce development time and costs. We believe that this solution will set a new standard for RF performance and efficiency in the wireless communications market." The ZCU670 evaluation board on-board RFMC expansion connector enables our users to quickly prototype and evaluate complete RF line designs for their radio solutions," said Brendan Farley, corporate vice president of wireless engineering at AMD. To demonstrate this, we have once again worked with Renesas to develop an optimized RF front-end reference design for the N78 band. As the OpenRAN 5G radio (O-RU) market continues to grow, these reference designs will help shorten the time to market for our mutual users with a proven solution."
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