Samsung Electro-Mechanics develops FCBGA semiconductor substrate for autonomous driving
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Update time : 2023-03-02 15:09:49
Samsung Electro-Mechanics has announced that it has developed an automotive semiconductor substrate (FCBGA, Flip Chip-Ball Grid Array) for advanced driver assistance systems (ADAS), expanding its lineup of high-end automotive semiconductor substrates, which Samsung Electro-Mechanics plans to supply to customers worldwide.
Samsung said that the newly developed FCBGA is suitable for high-performance autonomous driving systems and is one of the most technologically advanced products in automotive electronics. According to the report, the newly developed substrate, which has a 20 per cent reduction in circuit width and pitch, also achieves more than 10,000 bumps in a limited space, allowing for the design of higher density semiconductors, which will improve the performance and efficiency of chips based on the substrate. It also addresses reliability issues, including increased flexural strength, to cope with multi-chip packages where multiple chips are mounted on a single substrate at the same time. The FC-BGA package offers better electrical characteristics, significantly increased pin density, reduced interference, improved thermal performance and reduced package size to meet the needs of high-end and high-performance products. The chip bump is one of the key components of the FC interconnect structure and has three main functions: forming the electrical connection between the chip and the substrate, forming the structural connection between the chip and the substrate, and providing a means of heat dissipation for the chip. Samsung Electro-Mechanics said the new product is now certified to the AEC-Q100 standard for reliability testing of automotive electronic components and can be used in a variety of applications, from body and chassis to infotainment and autonomous driving.
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