Samsung plans to begin mass-scale production of its GAA-based 2nm chips by 2025
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Update time : 2022-06-20 15:12:50
It is reported that GAA is a next-generation process technology, which improves the structure of semiconductor transistors so that the gate can contact all four sides of the transistor instead of the three sides of the current FinFET process. GAA structure can control the current more accurately than the FinFET process.
According to trendforce, in the fourth quarter of 2021, TSMC accounted for 52.1% of the global OEM market, far more than 18.3% of Samsung Electronics. Samsung Electronics is betting on applying GAA technology to 3nm process to catch up with TSMC. It is reported that the Korean semiconductor giant used 3-nanometer GAA process wafers for pilot production in early June, becoming the first company in the world to use GAA technology. Samsung hopes to quickly narrow the gap with TSMC through technological leaps. The 3-nm process improves the semiconductor performance and battery efficiency by 15% and 30% respectively, and reduces the chip area by 35% compared with the 5-nm process. Following the application of GAA technology in its 3nm process in the first half of this year, Samsung plans to introduce it into the second generation 3nm chip in 2023 and mass produce the 2nm chip based on GAA in 2025. TSMC's strategy is to use a stable FinFET process to enter the 3nm semiconductor market in the second half of this year, while Samsung is betting on GAA technology. Experts say that if Samsung guarantees a stable output in the GAA based 3nm process, it can become a game changer in the OEM market. TSMC is expected to introduce GAA process from 2nm chips and release its first product around 2026. For Samsung Electronics, the next three years will be a critical period. Recently, Samsung announced that it would invest a total of 450trillion won (about 2.34 trillion yuan) in key industries such as semiconductors in the next five years. However, Samsung has encountered obstacles in the 3nm process. Like Samsung, TSMC has difficulties in increasing the output of the 3nm process.
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