TSMC Advanced Packaging and Testing Plant 6 officially opened: based on the 3DFabric technology platform, it can process more than 1 million 12-inch w
Views : 262
Update time : 2023-06-09 12:02:26
On June 8, TSMC, a leading foundry manufacturer, announced the official opening of its sixth advanced packaging and testing facility, becoming TSMC's first 3DFabric integration of front-to-back processes and testing services. Automated advanced packaging and testing plant. Prepare for mass production of TSMC-SoIC (System Integration Chip) process technology.
According to reports, the Advanced Packaging and Testing Plant 6 will enable TSMC to have a more complete and flexible production capacity planning of various TSMC 3DFabric advanced packaging and silicon stacking technologies such as SoIC, InFO, CoWoS and advanced testing, and will bring higher production yields and performance effects. TSMC said that in order to support the next generation of high-performance computing (HPC), artificial intelligence (AI) and mobile applications, help customers achieve product application success and win market opportunities, TSMC will start advanced packaging and testing in 2020. The construction project of the sixth plant is located in Zhunan Science Park. The base area of the plant is 14.3 hectares. It is TSMC's largest packaging and testing facility to date. The clean room area of its single plant area is larger than TSMC's other advanced packaging and testing fabs. The total fab is estimated to create millions of 12-inch wafers every year. Approximately equivalent 3DFabric process technology capacity, and more than 10 million test hours per year. He Jun, Deputy General Manager of TSMC Operations/Advanced Packaging Technology and Service, Quality and Reliability, said that microchip stacking is a key technology to improve chip performance and cost-effectiveness. In response to the strong three-dimensional integrated circuit (3DIC) market demand, TSMC has completed the deployment of advanced packaging and silicon stacking technology capacity in advance, providing technology leadership and production capacity to meet customer needs through the 3DFabric platform, jointly realizing technological innovation across the ages, and becoming an important partner that customers have long trusted. TSMC optimizes the production efficiency of the wafer factory with intelligent manufacturing. The total length of the five-in-one intelligent automated material handling system built in the factory exceeds 32 kilometers. The production information from wafer to grain is connected in series with the intelligent dispatching system to shorten the production cycle. Combined with artificial intelligence, it synchronously performs precise process control, detects anomalies in real time, and constructs a comprehensive chip-level (Die-level) big data quality defense network. The amount of data processed per second is 500 times that of the previous fab, and through product traceability (DieTraceability) to build a complete production history.
The LDK220 series of low-dropout linear regulators (LDOs) is a high-performance device designed specifically for low-power consumption and high-precision voltage regulation, widely used in scenarios such as consumer electronics, industrial control, and po
Xilinx Spartan®-7 FPGA Family stands as a defining solution in the mid-range FPGA landscape, blending high performance, energy efficiency, and cost-effectiveness to redefine versatility for industrial, IoT, and consumer electronics applications. Built on
The Altera FLEX series was more than a lineup of FPGAs—it was a blueprint for how programmable logic devices could evolve to meet diverse market needs. The FLEX 8000 laid the architectural groundwork, the FLEX 10K redefined functionality with embedded mem
Among TI standout offerings, the LM4765 and LM4766 are dual-channel amplifiers designed to cater to diverse audio needs—from compact setups to high-fidelity systems. While sharing the same product lineage, these chips differ significantly in power output,
