On June 17, according to Reuters, a TSMC executive said at a meeting on Thursday that the company would have the most advanced next-generation lithography tool of ASML in 2024.
Y.J. MII, senior vice president of TSMC R & D, said at the TSMC Silicon Valley Technology Seminar: "looking ahead, TSMC will introduce high NA EUV lithography machine in 2024 to develop relevant infrastructure and patterned solutions required by customers and promote innovation."
However, the official did not disclose when the device will be used for mass production. It is expected to be the second generation extreme ultraviolet lithography tool required to make smaller and faster chips. It home learned that Intel, a competitor of TSMC, has said that it will use the next generation lithography machine for production before 2025 and that it will take the lead in receiving the machine
As Intel enters the chip manufacturing business designed by other companies, it will compete with TSMC for customers. Therefore, the industry is paying close attention to which company has advantages in the next generation chip technology.
It is reported that Kevin Zhang, senior vice president of TSMC business development, later clarified that TSMC will not be ready to use the new high NA EUV for production in 2024, and will mainly be used for research purposes with partners.
"TSMC has it in 2024, which means that they can get the most advanced technology faster," said Dan Hutcheson, chip economist at techinsights who attended the seminar. "EUV technology is crucial to be in a leading position. High NA EUV is the next major innovation in technology, which will make chip technology in a leading position."
