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Chips produced by MediaTek using TSMC's 3nm process have been successfully taped out and are expected to be mass-produced in 2024

Update time : 2023-09-11 10:17:22

MediaTek and TSMC jointly announced today that the development progress of MediaTek's first flagship Tianji chip produced by TSMC's 3nm process is very smooth. It was successfully recorded a few days ago and is expected to be mass-produced next year. MediaTek and TSMC have maintained a close and deep strategic partnership for a long time. Both parties are leveraging their unique chip design and manufacturing strengths to jointly create high-performance, low-power flagship chips that empower end-point devices worldwide.

Chen Guanzhou, General Manager of MediaTek, said: "MediaTek's strategy of expanding the global flagship market is committed to using the world's most advanced technology to create cutting-edge technology products for users, enhancing and enriching people's lives. TSMC's stable and high-quality manufacturing capabilities allow MediaTek's excellent design on flagship chips to be fully demonstrated. Provide global customers with the best chip solutions with high performance, high energy efficiency and stable quality, bringing unprecedented user experience to the flagship market."
"Over the years, TSMC and MediaTek have worked closely together to bring many significant innovations to the market, and we are honored to continue working together on 3nm and more advanced technologies," said Dr. Hou Yongqing, TSMC's Senior Vice President of Eurasian Business and Technology Research. "The TSMC-MediaTek collaboration on the flagship Dimensity chip brings the semiconductor industry's leading process technology to mobile endpoints such as smartphones, enabling users around the world to enjoy an unparalleled user experience."
TSMC's 3nm process technology not only provides complete platform support for high-performance computing and mobile applications, but also enhances performance, power consumption and yield. Compared to the 5nm process, TSMC's 3nm process technology has approximately 60% increased logic density, 18% faster at the same power consumption, or 32% lower power consumption at the same speed.
MediaTek has been building Dimensity flagship chips based on industry-leading process technology to meet users' escalating experience needs in mobile computing, high-speed connectivity, artificial intelligence, multimedia entertainment and other fields, empowering smartphones, tablet computers, smart cars and other devices. MediaTek's first flagship chip using TSMC's 3nm process will be launched in the second half of 2024, injecting strong strength into the new generation of end-point devices and leading the user experience into a new chapter.

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