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CoWoS's advanced packaging production capacity is tight, and it is rumored that NVIDIA is urgently seeking assistance from Sunrise and Moonlight

Update time : 2023-08-28 14:47:48

Invida was previously constrained by the tight production capacity of TSMC's CoWoS advanced packaging, which led to a serious shortage of AI chip supply. Colette Kress, Executive Vice President and Chief Financial Officer of NVIDIA, publicly confirmed for the first time at a recent financial report meeting that it has certified the production capacity of other CoWoS packaging suppliers and predicted that supply will gradually increase in the coming quarters, while also collaborating with suppliers to increase production. According to a report from Taiwan Media Economic Daily, the latest news indicates that Nvidia has sought the assistance of the leading sealing and testing company, Sunrise, in providing advanced packaging services.

Sun and Moon do not comment on single customer and order dynamics. The industry points out that NVIDIA's entire AI chip structure design is the highest trade secret, and only with the assistance of professional foundries can IDM avoid the potential risk of confidential outflows in providing wafer foundry and testing services.
Previously, TSMC President Wei Zhejia also revealed that its advanced packaging capacity is fully loaded, and while the company is actively expanding production capacity, it will also outsource to professional packaging and testing factories. According to equipment manufacturers' estimates, TSMC's total CoWoS production capacity will exceed 120000 units in 2023, and it will surpass 240000 units in 2024, with Nvidia achieving 144000 to 150000 units.
The industry has revealed that Silicon Precision, a subsidiary of Sunrise, is one of NVIDIA's later stage packaging and testing supply chains. It has a competitive advantage in advanced packaging and is considered a major beneficiary of NVIDIA's high growth in orders outside of TSMC.
SunMoon Investment Control previously stated that SunMoon has strengthened the development of advanced packaging technology and made necessary investments when the time is ripe. It has collaborated with wafer fabs on intermediate layer related technologies and has a complete solution for the entire CoWoS process. FOCoS-Bridge is one of the six core packaging technology pillars of the company's VIPac platform, supporting high scalability and seamless integration into complex chip architectures, while providing high-density chip to chip (D2D) connectivity High I/O quantity and high-speed signal transmission to meet the constantly evolving needs of AI and high-performance computing (HPC).

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