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GUC GLink™ chip features proteanTecs chip-to-chip interconnect monitoring technology

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Update time : 2022-11-04 11:31:49
        proteanTecs, a global leader in deep data analysis for advanced electronics, announced that the results of the company's collaboration with advanced ASIC supplier C reative Electronics (GUC) have been published in a new white paper.
 
 
        The collaboration between GUC and proteanTecs began with reliability monitoring of the High Bandwidth Memory (HBM) interface and continued with GUC's second generation GLink™ interface, GLink 2.0, a high bandwidth die-to-die (D2D) parallel interface with industry-leading performance in terms of low latency and energy efficiency. proteanTecs interconnect monitoring solution is integrated into the GLink test chip, providing GUC with greater visibility to test and characterize PHYs and enhance the final product with in-field performance and reliability monitoring.
        ProteanTecs is currently the only company in the industry that offers full visibility of high-bandwidth D2D interfaces," said Igor Elkanovich, GUC's Chief Technology Officer. Their high resolution interconnect monitoring solution provides parametric channel grading with 100% channel and pin coverage, providing us with key insights to accelerate and enhance our device testing and characterization, and provide our customers with in-mission monitoring."
        Evelyn Landman, proteanTecs co-founder and CTO, said, "GUC's 2.5D/3D advanced packaging technology plays an important role in addressing the semiconductor industry's 'beyond the mole' evolution to chip and heterogeneous integration. We look forward to continuing our collaboration on GUC's family of D2D interface solutions to support the expanding advanced packaging ecosystem."

 
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