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Hanmi Semiconductor and Samsung Negotiate for Exclusive Supply of HBM Process Equipment

Update time : 2024-01-12 11:55:17

With the emergence of artificial intelligence (AI), the demand for high bandwidth memory (HBM) has surged, and its complex supply chain has become a focus of attention.

According to reports, South Korean semiconductor company Hanmi is discussing an exclusive supply agreement with Samsung Electronics regarding TC Bond bonding machine equipment that is crucial for the HBM process. If Hanmi Semiconductor reaches an agreement with Samsung, it will expand the customer base of the device manufacturer and increase its market share.
Given the applicability of HBM in the fields of artificial intelligence and high-performance computing (HPC), the silicon via (TSV) packaging technology required for HBM has become a focus of attention. In addition, the TC bonding machine produced by Hanmi Semiconductor is a key equipment for the TSV process required for manufacturing HBM.
As North American IT companies increase their investment efforts, the HBM market is growing rapidly. There are even predictions that the supply shortage of HBM will intensify in 2024. In this context, Samsung plans to officially supply the fourth generation HBM product HBM3 by the end of 2023 and early 2024, and plans to begin mass production of the fifth generation HBM product HBM3E. At the same time, it plans to ensure the industry's largest HBM production capacity through strategic investment by the end of 2024.
In 2017, Hanmi Semiconductor created the Dual TC Bond, which has four times the processing power of its predecessor. In 2023, the boom in artificial intelligence has driven a surge in demand for HBM, prompting Hanmi Semiconductor to enhance its production capacity. In August 2023, its new production facility, the Bond factory, was completed and received a large order of KRW 60 billion from customers in the second half of 2023 for the supply of Dual TC Bond 1.0 Griffin equipment.
With the surge in demand for HBM, the influence of Hanmi Semiconductor is steadily increasing. The potential agreement reached with Samsung regarding the supply of TC Bond equipment has triggered market predictions that Hanmi Semiconductor will become a supplier to the two major semiconductor giants in South Korea.
According to institutional data, Hanmi Semiconductor ranked 91st in the 2023 Global Semiconductor Top 100, with a growth rate of 426.04% in US dollars, making it a leading growth company among the top 100.

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