Industry News

Intel and Hi-Tech Semiconductor Reach New Foundry Agreement

Update time : 2023-09-07 11:21:14

According to reports, Intel today and Israeli chip foundry Tower Semiconductor reached a new foundry agreement.
According to the agreement, Tower Semiconductor will invest $300 million in Intel's Rio Rancho, New Mexico, plant, the acquisition and access to the plant will be installed to the equipment and other fixed assets. At that time, Hi-Tech Semiconductor will get the factory more than 600,000 monthly photo layer (photo layers) production capacity to meet the Hi-Tech Semiconductor customer demand for the next generation of 300 mm chips.
Russell Ellwanger, CEO of Hi-Tech Semiconductor, commented: "This is the first step towards a variety of unique synergistic solutions with Intel. This collaboration will not only enable us to meet our customers' demand roadmaps, but also has a special focus on advanced power management and RF on Insulator (RF SOI) solutions, with full process qualification planned for 2024.
Meanwhile, the deal will also enhance Intel's foundry capabilities at a time when the company is challenging rivals such as industry leader TSMC.
In 2021, Intel committed to investing $3.5 billion in a New Mexico plant, and a year later announced a $20 billion investment in a chip manufacturing facility in Ohio.
In the past year, Intel foundry services have indeed made great strides. In the second quarter of this year, Intel foundry business revenue of $232 million, an increase of more than 300%. Intel's goal is to become the world's second largest external foundry by 2030.
Before reaching this deal, Intel and Hightower Semiconductor just terminated an acquisition deal. Last February, Intel announced that it would acquire Hightower Semiconductor for $53 per share in cash, in a deal worth about $5.4 billion in total.

Previous : Vishay Introduces Miniature Infrared Sensor Module with Modulated Carrier Output for Code Learning Applications

Next : Samsung Announces Its Largest Capacity 32Gb DDR5 DRAM in the 12nm Class

LT1012CN8#PBF Analog Devices-operational amplifier: A Comprehensive Guide

May .23.2025

The ADI LT1012CN8#PB is a precision operational amplifier designed for applications demanding ultra-low offset voltage (25μV max), minimal bias current (±100pA max), and exceptional stability over temperature (0.6μV/°C drift). Part of the LT1012 series, i

Texas Instruments LM1875T/NOPB Audio Amplifiers:A Comprehensive Guide

May .21.2025

The Texas Instruments LM1875T/NOPB is a high-performance Class AB audio power amplifier designed for high-fidelity applications. Delivering up to 30W continuous power into 8Ω loads with ultra-low total harmonic distortion (THD ≤ 0.015%), it features a wid

STM32F101VBT6 by STMicroelectronics | Microcontrollers:A Comprehensive Guide

May .19.2025

The STMicroelectronics STM32F101VBT6 is a medium-density ARM Cortex-M3 microcontroller designed for embedded applications. It features a 32-bit Cortex-M3 core running at up to 36 MHz, offering 1.25 DMIPS/MHz performance with 0 wait-state memory access, 12

AMD XC7K160T-2FFG676I - FPGAs: A Comprehensive Guide

May .16.2025

The AMD XC7K160T - 2FFG676I, a member of the Kintex - 7 FPGA family, offers a compelling combination of features. It boasts a rich array of logic resources, allowing for the implementation of intricate digital designs, making it suitable for complex tasks

About Us

About Us What we do Quality People

Products

CHIP/IC Active devices Passive device Components OTHER

China electronic components supplier----Wah Luen Shing Electronic.----www.wlschip.com

Leave a message