Industry News

Intel is looking for "new materials and structures" to prepare 2000W class coolers for future chips

Update time : 2023-04-21 12:04:31

If you want to cool PC hardware, it's an air-cooled or water-cooled cooler, but with more and more transistors on the chip, Intel is investing early on in designing the next generation of submerged liquid cooling solutions to better manage heat, save energy, reduce costs and reduce carbon emissions, and plans to introduce the industry's first open IP submerged liquid cooling solution and public version of the design. The company plans to launch the industry's first open IP submerged liquid cooling solution and public design, allowing for greater adoption of submerged liquid cooling without the need for costly custom design solutions.

According to TomsHardware, Intel is not just satisfied with submerged liquid cooling, as its developers are working on novel solutions to increase the cooling level of next-generation chips to 2000W. Intel is currently looking for "new materials and structures" and is working closely with other innovative cooling technology companies to provide better cooling technology and develop "science fiction-like" cooling solutions.
One of Intel's new thermal solutions is based on a 3D homogenous heat sink that uses minimal space and an improved boiling enhancement coating to disperse boiling capacity within a sealed flat metal filled with liquid. Research has shown that coral-like heat sink designs with internal groove-like features have the greatest potential for external heat transfer coefficients for submerged liquid cooling. Intel envisions these ultra-low thermal resistance 3D homogeneous thermal panels integrated within a coral-like submerged liquid cooling heatsink manufactured using additive manufacturing technology.
Another way Intel looks to cool the highest power devices is with an array of fluid jets, regulated by artificial intelligence, that can spray cold nights over the hot spots of the chip to remove heat. Intel's cooling technology isn't all about efficiency and energy savings; the new cooling technology allows chips to run at lower temperatures, resulting in a 5 to 7 percent increase in performance at the same power.

Previous : Nexperia Introduces Advanced 650 V Silicon Carbide Diodes for Demanding Power Conversion Applications

Next : Q1 China Chips: Import Amount Down 26.7%, Import Quantity Down 22.9%

LSM115JE3/TR13 Microchip - Schottky Diodes

Apr .02.2025

The Microchip LSM115JE3/TR13 is a 1 Amp Schottky rectifier in the DO - 214BA package. It has a 15V working and repetitive peak reverse voltage. With features like a guard ring for reverse protection, low power loss, and high efficiency, it can handle a 50

LT1767EMS8-1.8#PBF Analog Devices Inc. | Power Management (PMIC)

Mar .31.2025

The Analog Devices Inc LT1767EMS8 - 1.8#PBF is a monolithic buck switching regulator. Operating at 1.25MHz, it has a 1.5A switch in an 8 - pin MSOP package. With a 3V - 25V input range, it offers a fixed 1.8V output with 2% tolerance. Its high - efficienc

DS1746-70+ Analog Devices / Maxim Integrated-Real Time Clocks ICS

Mar .28.2025

The DS1746-70+ is a highly advanced and fully functional real-time clock/calendar and nonvolatile static RAM. With its year-2000-compliant design, this product ensures accurate timekeeping and data storage without any risk of Y2K-related issues. The byte-

MBRS540T3G by onsemi Schottky Rectifiers

Mar .26.2025

Onsemi MBRS540T3G is a surface - mounted Schottky power rectifier. It features a compact J - bent pin package, ideal for space - saving, high - density PCB assembly. With a stable oxide - passivated chip, it ensures reliability and low leakage. It's RoHS

About Us

About Us What we do Quality People

Products

CHIP/IC Active devices Passive device Components OTHER

China electronic components supplier----Wah Luen Shing Electronic.----www.wlschip.com

Leave a message