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Japan's DISCO develops new wafer dicing machine that cuts silicon carbide 10 times faster

Update time : 2024-01-20 10:46:37

Japanese wafer equipment manufacturer DISCO launched a new SiC (silicon carbide) dicing machine in December 2023, which can increase the dicing speed of silicon carbide wafers by 10 times, and the first batch of products has been delivered to customers. Silicon carbide is difficult to cut because it is 1.8 times harder than silicon, second only to diamond and boron carbide.

In addition, DISCO developed a device 15 years ago that reduces waste during the processing of HBM high-bandwidth memory. Sales of such equipment have surged recently with the rise of artificial intelligence. Because of the high cost of HBM production, memory chip makers tend to outsource the back-end process, a strategy that has boosted demand for DISCO's equipment purchases.
It is reported, DISCO in the wafer dicing and grinding machine field occupies 70 ~ 80% market share, the company's market value in 2023, triple growth, and R & D spending hit a new high of 25 billion yen (about $ 175 million). DISCO's current focus is on HBM and silicon carbide wafer dicing equipment.
In July 2023, DISCO announced the establishment of an "intermediate process R&D center" in Kumamoto Prefecture, Japan. According to DISCO's definition, the intermediate process includes dicing of finished wafers, which is very important for yield and productivity, and therefore must be processed with care.
Although the U.S. and Japan have strengthened export controls on semiconductor equipment to China, DISCO's revenue in the Chinese market has not been affected for the time being. As of March 2022, about 31% of the company's revenue comes from China, increasing to 34% from July to September 2023.

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