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LG Electronics Selects Valens VA7000 Chipset for its Next Generation Camera System Program

Update time : 2023-08-17 11:58:51

Valens Semiconductor (NYSE: VLN, hereinafter referred to as Valens), a leading provider of high-performance connectivity solutions, announced that LG Electronics' Automotive Component Solutions division has chosen to deploy Valens' VA7000 MIPI A-PHY chipset family for its next-generation camera system program, which is part of its Digital Cockpit Electronics Solutions, designed to support advanced driver assistance systems (ADAS) for OEMs. It is expected that OEMs will be able to benefit from this innovative first-of-its-kind solution starting in 2026.

Valens' chips will be used to connect multiple camera sensors to the next-generation camera systems from LG's Automotive Components Division.The Valens chips will enable the seamless linking of sensing systems to help drivers make better-informed decisions and ensure the safety of the occupants.The VA7000 chipset has excellent electromagnetic compatibility and is capable of maintaining stable operation in complex electromagnetic environments; in addition, the The VA7000 chipset has excellent electromagnetic compatibility and can maintain stable operation in complex electromagnetic environments; in addition, the chipset family can also reduce the overall system cost, providing a cost-effective solution.
Gideon Kedem, senior vice president and head of Valens' automotive business, said, "Valens and LG Automotive share the same vision of delivering superior high-performance solutions to the automotive industry. This collaboration demonstrates Valens' execution of its strategy to develop disruptive and standardized high-performance connectivity solutions. This is a key milestone, marking the realization of mass production of the VA7000 MIPI A-PHY compatible chipset. The applications for these chips will be geared towards a huge multi-billion dollar market for high performance ADAS connectivity solutions." This further solidifies MIPI A-PHY's leadership as the connectivity standard for ADAS applications.
Juneun Park, vice president of head unit development at LG's Automotive Components Division, said, "After researching and evaluating other connectivity solutions in the market, we decided to partner with Valens and deploy its VA7000 MIPI A-PHY chipset in our next-generation camera system. The camera system is part of our digital cockpit electronics solution and the features and excellent EMC of the VA7000 have been validated by both parties. The two companies are now working closely together to realize mass production applications.LG Electronics is committed to enhancing its application capabilities in safety and reliability to provide our customers with solutions they can rely on. We expect this groundbreaking product to be ready for mass production in 2026. At the same time, we are looking forward to further expanding our collaboration with Valens to drive the widespread adoption of the MIPI A-PHY standard in the market."

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