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Lingsi technology completed the pre-A round of financing for self-developed chip R &D

Update time : 2022-08-11 14:11:58

China Youth Daily client news (Wei Wan, reporter of China Youth Daily and China Youth Network) Lingsi technology, an intelligent terminal system level electronic components(SOC) provider, recently completed the pre-A round of financing. The investment institutions are from emerging technology fields such as aiot (artificial intelligence internet of things) and semiconductors. According to the relevant person in charge, this round of financing funds will be mainly used for R & D investment and talent construction of self-developed chips, and accelerate the layout of the aiot intelligent market.

The csk6000 series intelligent voice interaction chip developed by Lingsi technology has been put into the market.
As early as 2020, the number of global IOT connections exceeded the number of non IOT connections, and the aiot industry entered a high-speed development period. However, due to the characteristics of long industrial chain and fragmented scenes, most of the IOT industry still adopts the technical scheme of general chips and general algorithms, which requires algorithms to adapt to the chips, resulting in great difficulties in development, adaptation and other aspects, and it is difficult for the reserve and investment of talents to keep up with the development needs. Due to the lack of the support of the underlying special chip, the difficulty and cost of artificial intelligence technology have been high, which greatly limits the rapid increase of AI penetration in the Internet of things industry. Customized intelligent chips deeply adapted to algorithms have become a major trend in the development of the Internet of things.
"The three Ironman capabilities of 'algorithm + chip + ecological service' built by Lingsi technology provide a cost-effective computing platform for downstream home appliances and consumer electronics enterprises to break through the price singularity, and also help solve their difficulties in R & D capacity and R & D cycle. It is expected to open the door to the rapid popularization of aiot intelligent terminals." Zhang Jincan, founding partner of Tianzhi investment, said.
The person in charge of Lingsi technology said that with the help of this round of financing, it will further accelerate chip R & D, complete multi-layer and multi-dimensional chip product matrix layout, create a "four-dimensional integration" ecosystem of chips, algorithms, scenarios and software, and help the rapid development of the intelligent terminal industry.

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