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Nikon Announces ArF Immersion Lithography NSR-S636E with 15% Increase in Productivity

Update time : 2023-12-21 11:10:33

Nikon has announced that it will release the ArF Immersion Scanner NSR-S636E from January 2024 as an exposure system for critical layers with higher productivity and a high level of overprint accuracy and throughput, according to an official Nikon news release.

As digital transformation accelerates, high-performance semiconductors capable of processing and transmitting large amounts of data faster are becoming increasingly important, Nikon said in its presentation. Key enablers of technological innovation for leading semiconductor performance are circuit pattern miniaturization and 3D semiconductor device structures, and ArF immersion scanners are critical for both manufacturing processes. The 3D semiconductor manufacturing process is more prone to wafer warpage and deformation than conventional semiconductors, requiring more advanced scanner calibration and compensation capabilities than ever before.
The NSR-S636E is described as an immersion lithography machine for critical layers. Nikon claims that it measures wafer warpage, distortion and other deformations with higher accuracy than ever before and achieves high overlap accuracy (MMO ≤ 2.1 nm.) The NSR-S636E ArF immersion scanner utilizes an enhanced iAS that performs complex multi-point measurements of wafers prior to exposure. This innovative system achieves high overlap accuracy (MMO ≤ 2.1 nm) by utilizing high-precision measurements and extensive wafer warpage and distortion correction capabilities. In addition, throughput has been increased to 280 shots per hour and, by reducing downtime, overall productivity has been increased by 10-15% compared to the current model, already reaching the highest productivity levels among the division's semiconductor lithography equipment.
In addition, Nikon said the exposure equipment offers excellent performance without sacrificing productivity in semiconductor manufacturing processes that require high overlap accuracy, such as three-dimensional semiconductors, which are undergoing further technological development as a way to improve semiconductor performance. The company said it will propose optimal solutions for the diverse needs of semi-advanced logic and memory as well as three-dimensional semiconductors such as CMOS image sensors and 3D NAND.

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