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proteanTecs Joins UCIe(TM) Consortium to Advance 2.5D/3D Interconnected Monitoring

Update time : 2022-09-26 17:45:27

HAIFA, Israel, Sept. 24, 2022 -- proteanTecs, a global leader in deep data analytics for advanced electronics, announced that it has joined the UCIe™ (Universal Core Interconnect Technology) consortium, bringing interconnect health monitoring to the expanding advanced packaging ecosystem.

Launched in March 2022, UCIe™ is designed to create universal interconnects at the package level in response to the proliferation of the "More Than Moore" market, which is expected to grow at a compound annual growth rate of 19% through 2027.
"Ensuring compliance and interoperability between chips will be a key area of focus for the UCIe Alliance as we build a vibrant ecosystem of chips," said Dr. Debendra Das Sharma, Chairman of the UCIe Alliance Board of Directors. the development of UCIe with their valuable contributions."
Evelyn Landman, proteanTecs co-founder and CTO, said, "We are ushering in a new era of semiconductor innovation and scale through advanced packaging, and the UCIe consortium is successfully uniting the industry. Joining UCIe will allow us to better tailor our interconnect monitoring roadmap to the needs of these emerging industries while sharing our extensive experience in providing visibility into thousands of potential failure points for heterogeneous systems, production and field applications."
proteanTecs offers high-resolution interconnection monitoring solutions that support visibility at every stage from characterization and certification, assembly and testing, to field deployment and operation. Unlike traditional methods that rely on low-finesse Pass/Fail testing, this market-leading, patented solution provides parametric interconnect channel grading and 100% interconnect channel and pin coverage.

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