Industry News

Samsung to Invest US$220 Million in Chip Production Line in Tokyo, Japan

Views : 42
Update time : 2023-05-16 15:42:09
        According to Japanese media reports, following TSMC's investment in a new wafer fab in Japan, South Korea's Samsung Electronics plans to invest 30 billion yen (about $220 million) to build a semiconductor back-end packaging and testing line in Yokohama, Japan, which is expected to be completed in 2025 for mass production. According to the report, the new facility will focus on the "back-end" of the chip process, which is the packaging and testing stage of the prototype wafer.
        Samsung used to focus on the development of advanced process miniaturization technology at the front end of the semiconductor, but in the current Moore's Law continues to slow down, advanced process advancement is increasingly difficult, Samsung has also begun to actively develop the back-end of the advanced packaging technology in recent years. As Japan is a powerhouse in semiconductor equipment and materials, Samsung hopes to work closely with Japanese material and equipment suppliers to achieve breakthroughs in semiconductor manufacturing. According to an analysis of the "Chip Act" passed in Japan, Samsung will receive approximately 10 billion yen (approximately US$73.6 million) in tax breaks and financial assistance for this investment, which is an incentive provided by the Japanese government for companies investing in the semiconductor chip manufacturing sector in the country.

        South Korean President Yun Seok-yue and Japanese Prime Minister Fumio Kishida are currently working to promote cooperation between the two countries' semiconductor companies, and the two leaders are also expected to meet again in the near future during the G7 summit in Hiroshima, Japan. The report also points out that Samsung's investment in Japan is actually aimed at rival TSMC as well. TSMC announced in 2021 that it would build a semiconductor fab in Kumamoto, Japan, in collaboration with SONY and DENSO, as part of Japan's plan to revive the development of the semiconductor manufacturing sector and to attract foreign investment in Japan. In addition to TSMC, US memory chip maker Micron is also investing in Japan and has been granted relevant rental tax incentives.

 
Related News
Read More >>
AMD XC7K160T-2FFG676I - FPGAs: A Comprehensive Guide AMD XC7K160T-2FFG676I - FPGAs: A Comprehensive Guide
May .16.2025
The AMD XC7K160T - 2FFG676I, a member of the Kintex - 7 FPGA family, offers a compelling combination of features. It boasts a rich array of logic resources, allowing for the implementation of intricate digital designs, making it suitable for complex tasks
Cypress/Infineon CY7C028V-20AXI Memory: A Comprehensive Guide Cypress/Infineon CY7C028V-20AXI Memory: A Comprehensive Guide
May .14.2025
The Cypress/Infineon CY7C028V - 20AXI is a 3.3V, 64K×16 dual - port static random - access memory (SRAM). It features a 0.35 - micron CMOS process, enabling a balance between high - speed access (20 ns) and low power consumption (120 mA typical operating
LFXP2-30E-5FN484C LATTICE -FPGA: A Comprehensive Guide LFXP2-30E-5FN484C LATTICE -FPGA: A Comprehensive Guide
May .12.2025
The LATTICE LFXP2-30E-5FN484C is a Field-Programmable Gate Array (FPGA) based on the flexiFLASH architecture of the LatticeXP2 series. It adopts a 90nm process and has a core power supply voltage of 1.2V. With 29,000 logic units, it is rich in logic resou
Intel / Altera 5M160ZT100C5N - CPLDs: A Comprehensive Guide Intel / Altera 5M160ZT100C5N - CPLDs: A Comprehensive Guide
May .09.2025
The Intel/Altera 5M160ZT100C5N is a 100 - pin TQFP packaged CPLD. It has 160 logic elements, rich I/O resources with 79 user I/O pins supporting various standards. It features internal oscillator, user flash memory block, and is suitable for low - power,