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Self-developed high-performance IGBT chips, Wang Chuanfu said: BYD Semiconductor will still seek listing

Update time : 2023-04-04 11:40:49

BYD has not only achieved the world's first good results in new energy vehicles, but is also one of the few domestic auto brands that can develop its own chips. However, BYD Semiconductor's 2022 listing plan was abruptly suspended, but founder Wang Chuanfu's latest statement, Seeking listing plans remain unchanged.

At the March 29 results meeting, Wang Chuanfu said that "BYD Semiconductor's listing plan remains unchanged, but there are some adjustments in the process." He also mentioned that BYD's vehicle growth cannot maintain such a high growth rate every year. As growth rates return to normal, BYD's share of the group's semiconductor business is expected to decline in due course in the future, and listing conditions will be in place at that time. "At that time, whichever market is attractive, go to the market.
BYD Semiconductor, formerly known as Shenzhen BYD Microelectronics Co., Ltd., will be renamed BYD Semiconductor Co., Ltd. in 2020. BYD holds 72.3% of the shares. After two rounds of funding received a $ 2.70 billion investment, it has been looking to go public. After the Shenzhen Stock Exchange accepted the IPO in June 2021, BYD Semiconductor suffered two IPO suspensions. Finally, on November 15, 2022, it suddenly announced the termination of the promotion of BYD Semiconductor's spin-off listing and withdrew the relevant listing application documents for the listing of growth enterprises.
BYD Semiconductor began developing IGBT and other automotive power module chips in 2005. In 2018, BYD Semiconductor released IGBT4.0 technology with reference significance in the field of vehicle specifications. The IGBT4.0 chip has refined the plane grid design, so that under the same working conditions, the total loss is reduced by about 20% compared to the mainstream products on the market, and the power consumption of the entire vehicle is significantly reduced.
By 2021, BYD Semiconductor's IGBT 5.0 technology based on high density Trench FS has been mass-produced. IGBT5.0 (Trecnch FS IGBT) adopts micro-trench structure and composite field termination technology to achieve ultra-low conduction loss and switching loss. Thanks to the highly tuned composite field termination technology, a soft shutdown has been achieved. In the domestic market, BYD's power module share reached 21.1% in the first three quarters of 2022, approaching 25.7% of the first Infineon.

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