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The American chip market shrinks, TSMC also adjusts its strategy, and media: the American chip era begins to end

Update time : 2022-11-08 11:30:28

The reason why the United States is known as the "World Silicon Valley" is not only that the United States has global leading semiconductor enterprises such as Intel, AMD, Qualcomm, Apple, etc., but also holds key technologies in the upstream industrial chain of chips, such as manufacturing technology. Although most of the global chip production capacity comes from Samsung and TSMC, most of the profits are captured by American enterprises.

When the tide of chip shortage swept across the world, TSMC, Intel, Qualcomm and other American chip companies and fabs did earn several times more than usual. But at present, the global chips are rapidly changing from "shortage" to "surplus", especially in the high-end chip market. Many American chip companies want to ask Chinese companies to help digest their inventory, but many Chinese companies have recognized the situation, and on the one hand, they are improving the diversification of the supply chain, On the other hand, it embarked on the road of independent research and development. As a result, some chip enterprises in the United States are full of inventory and the selling price has plummeted. Some enterprises sold a single chip for 90 yuan last year, but now the price has dropped to 10 yuan, they may not be able to find customers.
As the EUV lithography machine of AMSL endorsed by American technology and capital cannot be shipped freely, many domestic enterprises begin to improve the chip performance by upgrading packaging technology and substrate materials. It is worth noting that TSMC has also begun to adjust its strategy, and has established an innovative platform 3DFabric alliance with 19 partners to build a next-generation high-performance computing platform by using TSMC's 3DFabric technology, 3D silicon stacking, and advanced packaging technology.
TSMC created the 3DFabric alliance to seek a way out for subsequent development and reduce dependence on the existing EUV lithography machine, which is very similar to Apple's farewell to Intel! Because the times are about to change, the 20th century is indeed the era of "silicon", but at present, traditional silicon based chips are approaching the ceiling. TSMC spent 20 billion dollars to build a 3nm process production line, but on the eve of mass production, customers cancelled orders urgently. Samsung 3nm chips have been upgraded to GAA process. Relying on the existing EUV lithography machine, no one has an accurate answer on how to build 2nm and 1nm process chips in the future.
Therefore, upgrading chip packaging technology and replacing materials may be the only choice to continue Moore's Law, and behind this is the "decoupling" of major wafer manufacturers from American technology! That's exactly what happened. Some foreign media said: The era of American chip has begun to end.

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