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TI Announced Groundbreaking of Another 300mm Fab

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Update time : 2023-11-13 11:05:33
        Texas Instruments said it broke ground on its new 300-millimeter semiconductor wafer fabrication facility, or "fab," in Lihue, Utah, U.S.A. TI President and Chief Executive Officer Harvey Ihlan celebrated the first step in the construction of the new fab, LFAB2, which will be connected to the company's existing 300-millimeter fab in Lehigh, Utah. Once completed, TI's two Utah wafer fabs will be connected. Once completed, TI's two Utah fabs will be producing tens of millions of analog and embedded processing chips per day at full capacity.
 
 
        "Today, our company took an important step in expanding our manufacturing footprint Utah. This new facility is part of our long-term 300mm manufacturing roadmap to build the capacity our customers will need for decades to come." Ilan said. "At TI, our passion is to create a better world through semiconductors by making electronics cheaper. We're proud to be a growing member of the organization's Utah community and to make analog and embedded processing semiconductors that are critical to virtually every type of electronic system today."
        In February, TI announced an $11 billion investment in Utah, marking an economic investment in the state's history. lFAB2 will create approximately 800 additional jobs for TI, as well as thousands of indirect jobs, with the first production coming online as early as 2026.
        "TI's growing manufacturing presence in Utah will be transformative for our state, creating hundreds of good-paying jobs in Utah to make vital technology." Utah Governor Spencer Cox. "We're proud of semiconductor manufacturing Utah Utah's programs - innovations that will power the foundation of our state's economy and national security."
 
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