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Micron's Low-Power Memory Solutions Enable Qualcomm's 2nd Generation Snapdragon XR2 Platform to Enhance Mixed Reality (MR) and Virtual Reality (VR) Ex

Update time : 2023-11-11 10:45:41

Micron Technology, Inc. (NASDAQ: MU) recently announced that its low-power LPDDR5X DRAM and Universal Flash UFS 3.1 embedded solutions are now available in Qualcomm Technologies, Inc.'s latest extended reality (XR) platform, the second generation Snapdragon™ XR2 platform. --Qualcomm Technologies Inc.'s newest Extended Reality (XR) platform, the second-generation Snapdragon™ XR2, is now validated. Micron LPDDR5X and UFS 3.1 in a compact form factor offer higher speeds, better performance and lower power consumption for flexible support of mixed reality (MR) and virtual reality (VR) devices LPDDR5X is Micron's most advanced, low-power memory available today, with lower power consumption enabled by innovative 1α process node technology and JEDEC energy efficiency optimizations

The global augmented reality (AR) and virtual reality (VR) market is expected to reach $200 billion by 2030, growing at a compound annual growth rate of 24 percent from 2021[]. Micron's embedded products provide powerful, ready-to-use solutions for extended reality applications, accelerating consumer adoption and expanding market potential. Micron LPDDR5X and UFS 3.1 enable parallel processing across multiple applications and sensors to create a truly immersive experience for VR users by seamlessly integrating the ever-changing shape, position and perception of the metaverse.
Micron's LPDDR5X achieves peak rates of up to 8.533 Gbps and is backward compatible with LPDDR5 at 6.4 Gbps, providing device manufacturers with platform integration flexibility while reducing power consumption.
The metaverse holds tremendous potential to revolutionize the way we work and play," said Chris Jacobs, vice president and general manager of embedded markets at Micron. To bring this innovation to life, we need high-performance, low-power hardware that meets the ultra-fast speeds required for mixed reality experiences.
Micron LPDDR5X and UFS 3.1 solutions are ideal for next-generation XR devices, delivering the performance and power consumption needed to unlock rich virtual world experiences."
The second generation Snapdragon XR2 processor, which was recently announced on September 27th of this year, has been commercially available for the first time in Meta's latest headset, the Meta Quest 3, through close development with Meta. The second-generation Snapdragon XR2 platform offers a single-chip architecture that enables new immersive MR and VR experiences in a thinner, more comfortable headset that does not require an external battery pack. the Meta Quest 3 spatial computing platform delivers a latency-free experience with stunning visuals and immersive sound, allowing users to feel the fusion of virtual content with the real world and enable a seamless transition between MR and VR experiences. seamless transition between MR and VR experiences.
With 24 percent lower power consumption than the previous generation, LPDDR5X enables a better user experience through extended battery life, making it ideal for MR and VR headsets. Micron's LPDDR5X achieves a peak data transfer rate of 8.533 Gbps, enabling 33 percent faster data access for meta-universe applications, resulting in reduced response times. Micron's LPDDR5X memory, based on the 1α process node, delivers improved capacity density, performance and power efficiency for extended reality devices.
Micron UFS 3.1 client storage is the world's first UFS to utilize Micron's 176-layer NAND technology, featuring a compact form factor and high storage density to provide greater design flexibility for smaller devices such as MR and VR headsets.
Micron's 128GB UFS 3.1 and 8GB LPDDR5X are now validated on the Qualcomm Snapdragon platform and are available to the MR ecosystem through Micron's sales channels, resellers and partners.

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