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Toyota, Sony and other Japanese companies set up a joint venture company -- Rapidus

Update time : 2022-11-12 10:55:49

Comprehensive Japanese media reported on the 10th, in order to strive for the localization of the next generation of chips, Toyota, Sony, NTT and other eight Japanese companies have joined forces to set up a new company "Rapidus", the goal in the second half of the 2020s (2025-2029) to establish the next generation of logic chips for computing called "beyond 2 nanometers" manufacturing technology, and will build manufacturing lines, and will be constructed. The goal is to start the foundry business entrusted by chip design companies around 2030, and the Japanese government will also subsidize 70 billion yen, and it is expected that Japanese Minister of Economy, Trade and Industry Yasutoshi Nishimura will announce the above subsidy plan on the 11th.

The report points out that the new company's name "Rapidus" is derived from Latin, meaning "fast", is led by the Japanese chip equipment giant Tokyo Electron (TEL) former president Tetsuro Higashi and others to establish, in addition to the above three companies, NEC, Softbank, Denso, NAND Flash major armor (Kioxia) and Mit subishi UFJ also made a contribution, the amount of capital is estimated to be about 1 billion yen each.
According to reports, it is known that the University of Tokyo will join the research center, and will also cooperate with some European and American companies, research institutions, it is reported that IBM may also join. The new company "Rapidus" will play the role of linking the research results of the above-mentioned research center and mass production, by establishing the necessary technology for the production of next-generation chips and ensuring production capacity.
Meanwhile, the Japanese media also reported that the new company aims to establish the manufacturing technology of next-generation logic chips for computing called "beyond 2nm" in 2025-2029, and will build a manufacturing line and plan to start the foundry business commissioned by chip design companies around 2030.

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