Industry News

TSMC Launches a New Round of Orders to Advanced Packaging Equipment Suppliers

Update time : 2023-08-07 11:06:20

According to reports, TSMC has recently launched a new round of orders with advanced packaging equipment suppliers including Apic Yamada, Disco, GUUDENG Precision Industrial, and Scientech.

With the official mass production of AMD MI300 series in the fourth quarter, and Nvidia continuing to require TSMC to solve the shortage problem caused by insufficient CoWoS packaging capacity as soon as possible, TSMC was forced to accelerate the expansion of its advanced packaging capacity. In addition, TSMC has continued to receive CoWoS packaging orders from other major customers such as Amazon, Broadcom and Xilinx.
It is reported that the rapid demand of Nvidia AI GPU a few months ago led to a serious shortage of advanced packaging capacity of TSMC CoWoS. Recently, Wei Zhejia, president of TSMC, said frankly that he had previously held a conference call with customers to ask for expansion of CoWoS capacity. The equipment manufacturer estimates that TSMC's total CoWoS production capacity will exceed 120000 pieces in 2023, and will increase to 240000 pieces in 2024, of which Nvidia will obtain 144000~150000 pieces.
In June, TSMC Chairman Liu Deyin stated that TSMC's own advanced packaging capacity has almost doubled since last year, and if it wants to double again from this year to next year, it is indeed a challenge. In response to the expansion of CoWoS production capacity for advanced packaging next year, some INFO production capacity has even been moved to Nanke.
In July, TSMC announced that the new CoWoS advanced packaging plant will be built in Taiwan, China's Zhuke Causeway Park, with an estimated investment of NT $90 billion. The new plant is expected to be completed by the end of 2026, and mass production will begin in the third quarter of 2027.

Previous : AI chip startup Tenstorrent gets $100 million from Samsung and Hyundai

Next : Foxconn to invest $600 million in India to produce iPhone parts and chip manufacturing equipment

How many chips does a car need?

Sep .19.2024

Automotive chips can be divided into four types according to their functions: control (MCU and AI chips), power, sensors, and others (such as memory). The market is monopolized by international giants. The automotive chips people often talk about refer to

Position and Function of Main Automotive Sensors

Sep .18.2024

The function of the air flow sensor is to convert the amount of air inhaled into the engine into an electrical signal and provide it to the electronic control unit (ECU). It is the main basis for determining the basic fuel injection volume. Vane type: The

Chip: The increasingly intelligent electronic brain

Sep .14.2024

In this era of rapid technological development, we often marvel at how mobile phones can run various application software smoothly, how online classes can be free of lag and achieve zero latency, and how the functions of electronic devices are becoming mo

LDA100 Optocoupler: Outstanding Performance, Wide Applications

Sep .13.2024

In terms of characteristics, LDA100 is outstanding. It offers AC and DC input versions for optional selection, enabling it to work stably in different power supply environments. The small 6-pin DIP package not only saves space but also facilitates install

About Us

About Us What we do Quality People

Products

CHIP/IC Active devices Passive device Components OTHER

China electronic components supplier----Wah Luen Shing Electronic.----www.wlschip.com

Leave a message