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UMC's 40nm RFSOI platform to be mass-produced in 2024 for 5G mmWave applications

Update time : 2023-05-05 10:27:44

On May 3, foundry major UMC announced the launch of its 40nm RFSOI process platform for mass production of millimeter wave (mmWave) radio frequency (RF) front-end process products, which will boost the popularity of 5G wireless networks, including applications in smartphones, fixed wireless access (FWA) systems and small base stations.

UMC points out that while most 5G networks currently transmit in the sub-8GHz band, millimeter wave technology uses the band between 24GHz and 60GHz, providing ultra-high transmission speeds, extremely low latency and more stable connections. In response, UMC's 40nm RFSOI process platform is optimised for RF switches, low-noise amplifiers and power amplifiers that can handle a wider millimeter wave band while maintaining a compact size and meeting the need to include more RF components in millimeter wave modules to provide customers with a solution that integrates beamformers, core and passive components and front-end components in a single new RF chip.
Raj Verma, UMC's Executive Director of Technology Development, said that the development of 5G depends on the deployment of millimeter wave to provide the speed and capability required for virtual and augmented reality (VR/AR), smart cities, industrial automation and healthcare applications. With the launch of its 40nm RFSOI platform, UMC is expanding its portfolio of RF technologies to help customers bring their advanced 5G devices to market and capture opportunities in the growing millimeter wave market. Several customers have already approached UMC to develop customised 40nm RFSOI processes for their RF front-end products, with volume production expected to start in 2024.
UMC also highlighted that it already offers the most complete RF front-end module solutions for a wide range of market applications including mobile, Wi-Fi, automotive, IoT and satellite communications, with the RFSOI family of solutions produced on 8" and 12" wafers. Since 2014, UMC has had over 400 products tape-out and 35 billion RFSOI process ICs in various applications. UMC's 55nm RFSOI process has also been in production for many years, serving the 5G sub-8GHz market.

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