It is rumored that TSMC will work with Broadcom and Nvidia to develop silicon photonics technology and receive orders as soon as 2024
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Update time : 2023-09-16 12:09:57
According to Taiwan Media Economic Daily, artificial intelligence technology has set off a huge demand for data transmission, so silicon photonics and co-packaged optical components (CPO) have become the forefront of the industry. According to industry sources, TSMC not only actively promotes silicon photonics technology, but also jointly develops with major customers such as Broadcom and Nvidia, and will usher in large orders in the second half of 2024 at the earliest. Relevant process technologies cover 45nm to 7nm. TSMC has invested in a 200-person R&D team to target upcoming silicon photonic ultra-high-speed chip business opportunities next year. TSMC expects to achieve mass production of this technology by 2025.
In response to related rumors, TSMC said it does not respond to customer and product conditions. However, TSMC is highly optimistic about silicon photonics technology. Yu Zhenhua, vice president of TSMC, has publicly stated before, "If a good silicon photonics integration system can be provided, it can solve the key problems of energy efficiency and AI computing power. At SEMICON Taiwan 2023, silicon photonics technology has become a hot topic in the industry. Semiconductor giants such as TSMC and Sun Moonlight have delivered special lectures on related topics. Due to the huge demand for data throughput in AI computing, traditional bus loans that rely on circuit transmission can no longer meet the demand. Therefore, "silicon photonics" technology that transmits data through optical signals can make the data transmission speed between chips faster, which is highly anticipated by the industry. According to Taiwanese media, international semiconductor giants such as TSMC, Intel, Nvidia, and Broadcom have successively developed silicon photonics and co-packaged optical component technologies. It is expected that the market will experience explosive growth as soon as 2024. According to industry insiders, TSMC has established a research and development team of 200 people. In the future, silicon photonics technology can be introduced into CPU, GPU and other computing processes, and computing speed can be increased dozens of times. Industry analysis, high-speed data transmission still uses pluggable optical components. With the rapid development of transmission speed and entering the 800G era, as well as entering higher transmission rates such as 1.6T to 3.2T in the future, power loss and heat dissipation management will be the biggest problems. The solution proposed by the semiconductor industry is to integrate silicon photonic optical components and switching application specific chips (ASICs) into a single module through CPO packaging technology. This solution has begun to be adopted by major manufacturers such as Microsoft and Meta, and applied to a new generation of network architectures. However, even though CPO technology is expected to be mass-produced soon, the initial production cost is still high. As the advanced process advances to the 3nm node, AI computing will drive the demand for high-speed transmission and further drive the restructuring of the high-speed network architecture. It is expected that CPO technology will be indispensable in the future, and will enter the market in large quantities after 2025.
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