Sunbeam Launches Industry's First FOCoS Fan-Out Package Technology
Views : 137
Update time : 2022-11-05 10:08:31
November 4, 2012, Sun and Moonlight Semiconductor announced that the industry's first FOCoS (Fan Out Chip on Substrate) fan-out packaging technology has been launched on Sun and Moonlight's advanced packaging VIPack platform, which is mainly divided into Chip First (FOCoS-CF) and Chip Last (FOCoS-CL) solutions that can more effectively The chip on substrate technology is mainly divided into Chip First (FOCoS-CF) and Chip Last (FOCoS-CL) solutions, which can enhance the performance of high performance computing.
With the growing demand for high density, high speed and low latency chip interconnects, FOCoS-CF and FOCoS-CL solutions are innovative packaging technologies at a higher level. The fan out module is then placed on the substrate to realize the integration of multiple chips and small chips (Chiplet). Encapsulant-separated RDL is a Chip First technology that helps solve the problems associated with chip placement and design rules in traditional reconfigured wafer process technology. It is said that FOCoS-CF uses encapsulant-separated RDL to improve Chip Package Interaction (CPI), reduce the risk of chip stress and provide better high frequency signal integrity during the RDL manufacturing phase. It also improves the rules for higher-order chip design by reducing pad spacing to increase I/O density up to 10 times the existing one, while allowing integration of chips from different nodes and different fabs. The data shows that FOCoS-CL is particularly beneficial for integrating High Bandwidth Memory (HBM), an extremely important technology area that optimizes power efficiency and saves space. As the demand for HBM continues to grow in the HPC, services and networking markets, FOCoS-CL offers key performance and space advantages.
The LDK220 series of low-dropout linear regulators (LDOs) is a high-performance device designed specifically for low-power consumption and high-precision voltage regulation, widely used in scenarios such as consumer electronics, industrial control, and po
Xilinx Spartan®-7 FPGA Family stands as a defining solution in the mid-range FPGA landscape, blending high performance, energy efficiency, and cost-effectiveness to redefine versatility for industrial, IoT, and consumer electronics applications. Built on
The Altera FLEX series was more than a lineup of FPGAs—it was a blueprint for how programmable logic devices could evolve to meet diverse market needs. The FLEX 8000 laid the architectural groundwork, the FLEX 10K redefined functionality with embedded mem
Among TI standout offerings, the LM4765 and LM4766 are dual-channel amplifiers designed to cater to diverse audio needs—from compact setups to high-fidelity systems. While sharing the same product lineage, these chips differ significantly in power output,
