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Huawei Flip Chip Packaging Patent Announced to Improve Heat Dissipation Performance

Update time : 2023-08-16 10:57:44

A flip chip packaging patent of Huawei Technologies Co., Ltd. was published on the official website of the China National Intellectual Property Administration on August 15, with the number CN116601748A. The name of this patent is "Flip Chip Packaging with Improved Thermal Performance", which provides a way of contact between the chip and the heat sink, helping to improve heat dissipation performance.

According to the abstract description, the flip chip is packaged on a substrate, with the top of the chip exposed, but there are molded components surrounding the side of the chip. The bottom surface of the heat sink is in contact with the chip surface through a thermal interface material. In addition, adhesive is applied around the chip and components and between the heat sink.
Huawei described in its patent that recent advancements in processing performance of semiconductor packaging have placed higher demands on thermal performance to ensure stable operation. In this regard, flip chip packaging has advantages in terms of thermal performance, as its structural feature is that the chip is connected to the substrate through a convex block below it, which can position the heat sink on the top surface of the chip. In order to improve cooling performance, thermal interface materials such as thermal lubricating grease (TIM) are applied to the top surface of the chip and sandwiched between at least a portion of the chip and the heat sink. From the perspective of reducing the thermal resistance in TIM to improve the thermal performance of packaging, it is preferable to make the thickness of TIM smaller.
The previous heat dissipation scheme would make it difficult to control the thickness of the TIM layer, resulting in uneven thickness and other issues. Huawei's new patent states that due to the ability to easily control the height of the wall structure composed of mold compounds during the molding process, the thickness of the thermal interface material can be adjusted to the desired small thickness, thereby achieving improved thermal performance.
This patent can be applied to chip types such as CPU, FPGA, ASIC, GPU, etc. The supported devices can be smartphones, tablets, wearable mobile devices, as well as PCs, workstations, servers, cameras, etc.

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