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Intel announces packaging and test facility in Poland: $4.6 billion investment expected, approximately 2,000 employees needed to operate

Update time : 2023-06-20 14:05:17

Intel announced its selection of a new semiconductor assembly and test facility near Wroclaw in southwestern Poland that will help meet Intel's critical need for assembly and test capacity by 2027. Design and planning for the new facility will begin immediately, with construction pending approval from the European Commission.

Intel expects to invest approximately $4.6 billion and will require approximately 2,000 employees to operate the facility, in addition to the thousands of jobs that will be created by the construction of the facility. The new facility will require a large number of engineers, operators and equipment technicians, and Intel believes that Poland has a strong technical talent base with strong engineering programs at several excellent universities, which will influence the future operations of Intel's Poland facility for the next three decades.
Intel currently has several semiconductor engineering projects in Europe, including a wafer fabrication facility in Leixlip, Ireland, a planned wafer fabrication facility in Magdeburg, Germany, and this time an assembly and test facility in Poland. Intel said these projects will help create Europe's first cutting-edge semiconductor manufacturing value chain, while also serving as a catalyst for investment and innovation in Poland and the entire EU semiconductor ecosystem. Intel expects the three factories to work closely with each other, which will improve the resilience and cost efficiency of the European semiconductor supply chain.
Intel says it will adhere to high environmental standards and commit to sustainability in its global operations, and this plan for Wroclaw, Poland, will do the same, built according to green building principles to minimize its carbon footprint and environmental impact.

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