Industry News

Intel has placed an order with TSMC for subsequent GPUs: Battlemage and Celestial will use 4nm and 3nm respectively

Views : 12
Update time : 2023-04-07 13:44:52
        As a new high-performance gaming graphics card brand, Intel Arc's first generation product was the Alchemist graphics card (DG2). According to the development plan previously announced by Intel, Alchemist will be followed by Battlemage, Celestial, and Druid, with a total of four generations of products. Unlike the previous three generations, the fourth generation Druid will adopt a new Xe architecture to replace the original Xe-HPG architecture.
 
 
        According to CTEE, TSMC has won a very large GPU production order from Intel, including Battlemage and Celestial after Alchemist. Intel remains optimistic about the prospects of the GPU market, believing that e-sports and artificial intelligence on the consumer end will continue to drive demand, while the demand for artificial intelligence and other intensive computing in the enterprise market is still growing.
        Intel is currently promoting GPU research and development projects as planned. It is rumored that the second generation Battlemage graphics card will be launched in the second half of 2024, manufactured using the 4nm process. The third generation Celestial graphics card will be launched in the second half of 2026, manufactured using the 3nm process. Last year, it was reported that most members of the Intel GPU development team have transferred to the development of the second-generation product Battlemage, and early driver and software stack work has also been underway. Some members have even started preliminary work on the third-generation product Celestial.
        Previously, Intel researcher Tom Peterson stated in a media interview that Intel had divided the Xe series architecture into four types on Alchemist based on the needs of segmented markets, product scalability, and specific applications. Based on the lessons learned, Battlemage will be simplified into two architectures, Xe2-LPG and Xe2-HPG, which will simplify driver development, reduce costs, and improve compatibility.
        In order to meet cost reduction and efficiency improvement plans, Intel has previously split the Accelerated Computing and Graphics Division (AXG) into two parts, with the Consumer Graphics team joining the Client Computing Division (CCG) and the Accelerated Computing team joining the Data Center and Artificial Intelligence Division (DCAI). The future Xe2-LPG architecture and Xe2-HPG architecture will be developed under the leadership of the client computing business unit, while the Xe-HPC architecture will be managed by the data center and artificial intelligence business unit.

 
Related News
Read More >>
How many chips does a car need? How many chips does a car need?
Sep .19.2024
Automotive chips can be divided into four types according to their functions: control (MCU and AI chips), power, sensors, and others (such as memory). The market is monopolized by international giants. The automotive chips people often talk about refer to
Position and Function of Main Automotive Sensors Position and Function of Main Automotive Sensors
Sep .18.2024
The function of the air flow sensor is to convert the amount of air inhaled into the engine into an electrical signal and provide it to the electronic control unit (ECU). It is the main basis for determining the basic fuel injection volume. Vane type: The
Chip: The increasingly intelligent electronic brain Chip: The increasingly intelligent electronic brain
Sep .14.2024
In this era of rapid technological development, we often marvel at how mobile phones can run various application software smoothly, how online classes can be free of lag and achieve zero latency, and how the functions of electronic devices are becoming mo
LDA100 Optocoupler: Outstanding Performance, Wide Applications LDA100 Optocoupler: Outstanding Performance, Wide Applications
Sep .13.2024
In terms of characteristics, LDA100 is outstanding. It offers AC and DC input versions for optional selection, enabling it to work stably in different power supply environments. The small 6-pin DIP package not only saves space but also facilitates install