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MediaTek: 3nm Process Chips have been Successfully Tape-out and are Expected to be Mass-produced in 2024

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Update time : 2023-09-08 16:14:15
        Today, MediaTek and TSMC jointly announced that the development of MediaTek's first Dimensity flagship chip produced using TSMC's 3nm process is progressing smoothly, and it has been successfully tape-out and is expected to be mass-produced next year.
 
 
        Guanzhou Chen, General Manager of MediaTek, said: "MediaTek's strategy to expand the global flagship market is committed to using the world's most advanced technology to create cutting-edge technology products for users to enhance and enrich people's lives. TSMC's stable and high-quality manufacturing capabilities allow MediaTek's excellent design on flagship chips to be fully displayed, and the best chip solutions with high performance, high energy efficiency and stable quality can be provided to global customers, bringing unprecedented user experience to the flagship market. ”
        TSMC's 3nm process technology not only provides complete platform support for high-performance computing and mobile applications, but also provides enhanced performance, power consumption, and yield. Compared to the 5nm process, TSMC's 3nm process technology has approximately 60% higher logic density, 18% faster at the same power consumption, or 32% lower power consumption at the same speed.

 
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