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ONSEMI Launches the World's First 650 V SiC MOSFET in Toll Package

Update time : 2022-05-13 17:15:13

ONSEMI which is ahead of smart power supply and smart sensing technology, released the world's first To-Leadless (Toll) encapsulated Silicon Carbide (SIC) MOSFET at PCIM Europe. The transistor meets the rapidly growing demand for high-performance switching devices suitable for high power density design. Until recently, SiC devices have been packaged in D2Pak 7-pin packages that obviously require more space.

The size of Toll package is only 9.90 mm x 11.68 mm, which is 30% less than the PCB area of D2Pak package. Moreover, its shape is only 2.30 mm, which is 60% smaller than that of D2Pak package.
In addition to the smaller size, the toll package also provides better thermal performance and lower package inductance (2 NH) than D2Pak 7 pin. Its Kelvin source configuration ensures lower gate noise and switching loss – including a 60% reduction in EON compared to devices without Kelvin configuration, ensuring significant improvements in energy efficiency and power density in challenging power design, as well as improved EMI and easier PCB design.
The Toll package is guaranteed humidity sensitivity level 1 (MSL1) to ensure that the failure rate in mass production is reduced. In addition, ONSEMI also provides vehicle specification level devices, including TO-247 3-pin, 4-pin and D2Pak 7-pin packages.

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