According to the news on October 25th, as reported by Kyodo News and The Nikkei on local time yesterday, Atsuyoshi Koike, the president of Japan's advanced chip manufacturer Rapidus, said that if the mass production of the 2nm process goes smoothly, they plan to build a second wafer fab with an even more advanced 1.4nm process.
Atsuyoshi Koike made this statement on the 24th when accompanying Yasuharu Muto, the Minister of Economy, Trade and Industry of Japan, to inspect the 2nm wafer fab IIM-1 that Rapidus is currently constructing in Chitose City, Hokkaido. He also mentioned that about 80% of the construction of the IIM-1 building has been completed.
According to Rapidus's plan, the IIM-1 will be completed in the first quarter of 2025, and the trial production line will start operation in April of the same year. The formal mass production of the 2nm advanced process will begin in 2027.
Yasuharu Muto stated that during the process of the Japanese government's discussion on a new round of economic measures, the Ministry of Economy, Trade and Industry "will consider and coordinate with relevant ministries and agencies" (regarding additional financial support for Rapidus), and emphasized that "the government hopes to submit a bill to the Diet as soon as possible to provide necessary support including loans while examining the activities of the private sector (loans to Rapidus)."
Rapidus has previously received a cumulative government financial support of approximately 920 billion yen (Note from IT Home: currently about 43.135 billion yuan). However, there is still a huge gap of around 4 trillion yen (currently about 187.544 billion yuan) to achieve mass production of 2nm chips.
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