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Samsung Electro-Mechanics started mass production of server semiconductor packaging substrates for the first time in Korea this month

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Update time : 2022-07-19 13:01:34
        According to Korean media reports on July 18, Samsung Electro-Mechanics this month in South Korea for the first time in the domestic mass production of FCBGA for servers. for servers, networking FCBGA substrate area is more than four times than the FCBGA for ordinary PCs.
         Samsung Electro-Mechanics recently decided to invest 1.9 trillion won in the semiconductor packaging substrate (FCBG, flip chip ball grid array) process. The role of the semiconductor packaging substrate is to transfer electrical signals between the semiconductor chip and the main substrate and to protect the semiconductor from external shocks, etc. Among semiconductor packaging substrates, Samsung Electro-Mechanics "focuses on FCBGA". It is mainly used for CPUs (central processing units) and GPUs (graphics processors) that require high performance and high-density circuit connections, such as PCs and servers.
        With the development of fifth-generation mobile communications (5G), cloud (Cloud), artificial intelligence (AI) technology, etc., FCBGA and other high-specification products are reportedly showing a sharp increase in demand worldwide, but the market is currently in short supply due to the small number of companies with technical capabilities. According to Korean industry sources, the overall semiconductor packaging substrate market is expected to increase from $11.3 billion to $17 billion from 2022 to 2026, with an average annual growth rate of 10%. Among them, the average annual growth of high specification semiconductor packaging substrate is expected to reach 15.7%.
 
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