English
Русский
Home
Products
Feedback
About Us
Contact Us
Recycling
Inquiry
English
en
Русский
Inquiry (0)
Home
Products
Feedback
About Us
Contact Us
Recycling
Inquiry
Industry News
Home > Industry News

Samsung's Advanced Packaging Technology Lags TSMC: It 's Hard to Get Orders for AI Chips

Views : 13
Update time : 2023-07-05 14:01:18
        July 3 news, Nvidia A100 and H100 are currently completely outsourced to TSMC foundry, Samsung failed to win any orders, this is entirely because TSMC CoWoS advanced packaging technology is leading.
        By 2023, AI chips will rise, and Nvidia's GPU demand for CoWoS will soar from an estimated 30,000 at the beginning of the year to 45,000, and orders will have to be added in advance. Now Nvidia, Apple and AMD all rely on TSMC's advanced process and packaging technology.
        According to a report by market research firm Yole Development, Intel and TSMC will account for 32% and 27% of global advanced packaging investment in 2022, with Samsung ranking only fourth, even behind Taiwan's packaging and testing giant.
        Therefore, even if Samsung leads TSMC in successfully mass-producing 3nm process wafers in 2022, global leaders such as Nvidia and Apple still hope to use TSMC's production capacity, which also makes the current large foundry orders for all AI and autonomous driving chips. Almost all are in TSMC's hands .
        It is worth noting that Samsung also said at the Hot Chips conference in June 2021 that it is developing advanced 3.5D packaging technology, but Samsung did not disclose specific details. The establishment of Samsung's advanced packaging working group obviously means that Samsung will further increase its investment in advanced packaging technology, aiming to narrow the gap with Intel and TSMC in the field of advanced packaging.

 
Previous :
Next :
Related News
Read More >>
How many chips does a car need? How many chips does a car need?
Sep .19.2024
Automotive chips can be divided into four types according to their functions: control (MCU and AI chips), power, sensors, and others (such as memory). The market is monopolized by international giants. The automotive chips people often talk about refer to
Position and Function of Main Automotive Sensors Position and Function of Main Automotive Sensors
Sep .18.2024
The function of the air flow sensor is to convert the amount of air inhaled into the engine into an electrical signal and provide it to the electronic control unit (ECU). It is the main basis for determining the basic fuel injection volume. Vane type: The
Chip: The increasingly intelligent electronic brain Chip: The increasingly intelligent electronic brain
Sep .14.2024
In this era of rapid technological development, we often marvel at how mobile phones can run various application software smoothly, how online classes can be free of lag and achieve zero latency, and how the functions of electronic devices are becoming mo
LDA100 Optocoupler: Outstanding Performance, Wide Applications LDA100 Optocoupler: Outstanding Performance, Wide Applications
Sep .13.2024
In terms of characteristics, LDA100 is outstanding. It offers AC and DC input versions for optional selection, enabling it to work stably in different power supply environments. The small 6-pin DIP package not only saves space but also facilitates install
Email