Industry News

Sunbeam Launches Industry's First FOCoS Fan-Out Package Technology

Update time : 2022-11-05 10:08:31

November 4, 2012, Sun and Moonlight Semiconductor announced that the industry's first FOCoS (Fan Out Chip on Substrate) fan-out packaging technology has been launched on Sun and Moonlight's advanced packaging VIPack platform, which is mainly divided into Chip First (FOCoS-CF) and Chip Last (FOCoS-CL) solutions that can more effectively The chip on substrate technology is mainly divided into Chip First (FOCoS-CF) and Chip Last (FOCoS-CL) solutions, which can enhance the performance of high performance computing.

With the growing demand for high density, high speed and low latency chip interconnects, FOCoS-CF and FOCoS-CL solutions are innovative packaging technologies at a higher level. The fan out module is then placed on the substrate to realize the integration of multiple chips and small chips (Chiplet). Encapsulant-separated RDL is a Chip First technology that helps solve the problems associated with chip placement and design rules in traditional reconfigured wafer process technology.
It is said that FOCoS-CF uses encapsulant-separated RDL to improve Chip Package Interaction (CPI), reduce the risk of chip stress and provide better high frequency signal integrity during the RDL manufacturing phase. It also improves the rules for higher-order chip design by reducing pad spacing to increase I/O density up to 10 times the existing one, while allowing integration of chips from different nodes and different fabs.
The data shows that FOCoS-CL is particularly beneficial for integrating High Bandwidth Memory (HBM), an extremely important technology area that optimizes power efficiency and saves space. As the demand for HBM continues to grow in the HPC, services and networking markets, FOCoS-CL offers key performance and space advantages.

Previous : Micron Announces Successful Bypass of EUV Lithography and Readiness for Mass Production

Next : TSMC spends US$12 billion to set up a plant in the US, sparking concern in Taiwan society

How many chips does a car need?

Sep .19.2024

Automotive chips can be divided into four types according to their functions: control (MCU and AI chips), power, sensors, and others (such as memory). The market is monopolized by international giants. The automotive chips people often talk about refer to

Position and Function of Main Automotive Sensors

Sep .18.2024

The function of the air flow sensor is to convert the amount of air inhaled into the engine into an electrical signal and provide it to the electronic control unit (ECU). It is the main basis for determining the basic fuel injection volume. Vane type: The

Chip: The increasingly intelligent electronic brain

Sep .14.2024

In this era of rapid technological development, we often marvel at how mobile phones can run various application software smoothly, how online classes can be free of lag and achieve zero latency, and how the functions of electronic devices are becoming mo

LDA100 Optocoupler: Outstanding Performance, Wide Applications

Sep .13.2024

In terms of characteristics, LDA100 is outstanding. It offers AC and DC input versions for optional selection, enabling it to work stably in different power supply environments. The small 6-pin DIP package not only saves space but also facilitates install

About Us

About Us What we do Quality People

Products

CHIP/IC Active devices Passive device Components OTHER

China electronic components supplier----Wah Luen Shing Electronic.----www.wlschip.com

Leave a message