Industry News

Taiwan media: TSMC's CoWoS production capacity will reach 240000 pieces in 2024, and Nvidia will obtain 150000 pieces at most

Update time : 2023-07-31 12:02:30

According to the DigiTimes of Taiwan media, a few months ago, the rapid demand for Nvidia AI GPU led to a serious shortage of advanced packaging capacity of TSMC CoWoS. Recently, Wei Zhejia, president of TSMC, said frankly that he had previously held a conference call with customers to request to expand CoWoS capacity. The equipment manufacturer estimates that TSMC's total CoWoS production capacity will exceed 120000 pieces in 2023, and will increase to 240000 pieces in 2024, of which Nvidia will obtain 144000~150000 pieces.

Last month, TSMC Chairman Liu Deyin stated that TSMC's own advanced packaging capacity has almost doubled since last year, and it is indeed a challenge to double it again from this year to next year. In response to the expansion of CoWoS production capacity for advanced packaging next year, and even moving some of its INFO production capacity to Nanke, TSMC hopes to expand CoWoS production capacity in Longtan. Many plans will be actively promoted, hoping to meet the immediate needs of customers.
TSMC also stated at a recent legal conference that the current bottleneck in AI chip related production capacity is mainly concentrated in the backend CoWoS link. TSMC is closely cooperating with customers to expand production capacity, and it is expected that the production capacity tension of CoWoS will be alleviated by the end of 2024. The CoWoS production capacity in 2024 will reach about twice the level of 2023.
To cope with the problem of insufficient capacity, TSMC recently announced that it plans to spend nearly NT $90 billion to set up an advanced packaging wafer factory in Taiwan, China's Zhuke Causeway Science park. After two months of cross departmental negotiations, the Zhuke Management Bureau recently officially issued a letter agreeing to TSMC's acquisition of approximately 7 hectares of land in the Zhuke Causeway Park. The new factory is expected to be completed by the end of 2026 and mass production will begin in the third quarter of 2027.

Previous : Stellantis, Samsung SDI plan second U.S. battery plant

Next : In response to the demand for AI chips, TSMC spent NT$90 billion to build an advanced packaging plant

DS1746-70+ Analog Devices / Maxim Integrated-Real Time Clocks ICS

Mar .28.2025

The DS1746-70+ is a highly advanced and fully functional real-time clock/calendar and nonvolatile static RAM. With its year-2000-compliant design, this product ensures accurate timekeeping and data storage without any risk of Y2K-related issues. The byte-

MBRS540T3G by onsemi Schottky Rectifiers

Mar .26.2025

Onsemi MBRS540T3G is a surface - mounted Schottky power rectifier. It features a compact J - bent pin package, ideal for space - saving, high - density PCB assembly. With a stable oxide - passivated chip, it ensures reliability and low leakage. It's RoHS

Microchip Technology PIC16F15323-I/JQ - 8-bit Microcontrollers

Mar .24.2025

The Microchip PIC16F15323-I/JQ is an 8-bit microcontroller with a CPU speed of 32MHz. It is part of the PIC16 family of microcontrollers, specifically the PIC16F153Xx series. This particular model has a program memory size of 3.5KB and a RAM memory size o

PIC16F15323-I/ST Microchip Technology-8 Bit MCU

Mar .21.2025

One of the key features of the PIC16F15323-I/ST is its support for PWMs, multiple communication protocols, a temperature sensor, and innovative memory management features like Memory Access Partition (MAP) and Device Information Area (DIA). These capabili

About Us

About Us What we do Quality People

Products

CHIP/IC Active devices Passive device Components OTHER

China electronic components supplier----Wah Luen Shing Electronic.----www.wlschip.com

Leave a message