Industry News

Taiwan media: TSMC's CoWoS production capacity will reach 240000 pieces in 2024, and Nvidia will obtain 150000 pieces at most

Update time : 2023-07-31 12:02:30

According to the DigiTimes of Taiwan media, a few months ago, the rapid demand for Nvidia AI GPU led to a serious shortage of advanced packaging capacity of TSMC CoWoS. Recently, Wei Zhejia, president of TSMC, said frankly that he had previously held a conference call with customers to request to expand CoWoS capacity. The equipment manufacturer estimates that TSMC's total CoWoS production capacity will exceed 120000 pieces in 2023, and will increase to 240000 pieces in 2024, of which Nvidia will obtain 144000~150000 pieces.

Last month, TSMC Chairman Liu Deyin stated that TSMC's own advanced packaging capacity has almost doubled since last year, and it is indeed a challenge to double it again from this year to next year. In response to the expansion of CoWoS production capacity for advanced packaging next year, and even moving some of its INFO production capacity to Nanke, TSMC hopes to expand CoWoS production capacity in Longtan. Many plans will be actively promoted, hoping to meet the immediate needs of customers.
TSMC also stated at a recent legal conference that the current bottleneck in AI chip related production capacity is mainly concentrated in the backend CoWoS link. TSMC is closely cooperating with customers to expand production capacity, and it is expected that the production capacity tension of CoWoS will be alleviated by the end of 2024. The CoWoS production capacity in 2024 will reach about twice the level of 2023.
To cope with the problem of insufficient capacity, TSMC recently announced that it plans to spend nearly NT $90 billion to set up an advanced packaging wafer factory in Taiwan, China's Zhuke Causeway Science park. After two months of cross departmental negotiations, the Zhuke Management Bureau recently officially issued a letter agreeing to TSMC's acquisition of approximately 7 hectares of land in the Zhuke Causeway Park. The new factory is expected to be completed by the end of 2026 and mass production will begin in the third quarter of 2027.

Previous : Stellantis, Samsung SDI plan second U.S. battery plant

Next : In response to the demand for AI chips, TSMC spent NT$90 billion to build an advanced packaging plant

Chip: The increasingly intelligent electronic brain

Sep .14.2024

In this era of rapid technological development, we often marvel at how mobile phones can run various application software smoothly, how online classes can be free of lag and achieve zero latency, and how the functions of electronic devices are becoming mo

LDA100 Optocoupler: Outstanding Performance, Wide Applications

Sep .13.2024

In terms of characteristics, LDA100 is outstanding. It offers AC and DC input versions for optional selection, enabling it to work stably in different power supply environments. The small 6-pin DIP package not only saves space but also facilitates install

WLS Electronic Compoenents Mid - Autumn Festival Holiday Notice

Sep .12.2024

The Mid-Autumn Festival has a long history. In ancient times, the term "Mid-Autumn" already appeared in "The Rites of Zhou". In ancient China, offering sacrifices to the moon at the autumn equinox was a very important activity, which has become one of the

TSMC's 3nm Chip Outsourcing Packaging and Testing Orders Have Officially Exploded

Sep .10.2024

TSMC's 3nm and 5nm processes are expected to bring up to 1 trillion New Taiwan Dollars in revenue to this Taiwanese giant, exceeding industry expectations.
There is no denying that TSMC has been in the leading position in the industry in terms of process

About Us

About Us What we do Quality People

Products

CHIP/IC Active devices Passive device Components OTHER

China electronic components supplier----Wah Luen Shing Electronic.----www.wlschip.com

Leave a message