TSMC continues to expand CoWoS packaging capacity
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Update time : 2024-01-17 09:47:14
According to industry sources, TSMC continues to expand its CoWoS packaging capacity despite recent market rumors that NVIDIA has scaled back orders with TSMC foundries for 2024.
Recent market rumors suggest that NVIDIA's revenues in mainland China have collapsed and that other markets are unable to fill the huge demand gap in mainland China. In addition, the HGX H200, the next-generation GPU that succeeds the H100, will be available in the second quarter and sales will increase in the third quarter. Customer orders for the existing H100 and new H200 chips are being adjusted, creating uncertainty.
Rumor has it that due to these uncertainties, NVIDIA has for the first time cut orders for TSMC's expected 4nm process and CoWoS capacity.
The fab equipment maker said TSMC's available CoWoS capacity is still insufficient to meet demand. Despite TSMC's efforts to accelerate equipment modifications, CoWoS capacity will be only 15,000 wafers per month by the end of 2023, the sources said.
TSMC is modifying some of its InFO (integrated fan-out) equipment to support CoWoS production, which still handles the majority of advanced packaging shipments, the sources noted.Monthly production capacity for CoWoS packaging is expected to reach 17,000 wafers in the first quarter of 2024.
TSMC is also allocating more fab capacity for CoWoS production, which will lead to a quarterly increase in monthly production capacity for CoWoS packages in 2024, ultimately reaching 26,000-28,000 wafers, the sources said.
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