TSMC's Advanced Packaging Customers Chase Orders, Next Year's Monthly Capacity to Rise 120%
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Update time : 2023-11-17 10:30:41
According to Taiwan Economic Daily, demand for TSMC's CoWoS advanced packaging has exploded, and in addition to NVIDIA's confirmed order expansion in October, heavyweight customers such as Apple, AMD, Broadcom, Marvell and others have also been pursuing orders significantly in the near future.
It is said that TSMC, in order to cope with the demand of the above five major customers, has been working hard to accelerate the expansion of CoWoS advanced packaging production capacity, and it is expected that next year's monthly production capacity will be increased by about 20% over the original target to reach 35,000 pieces.
Industry analysts say that TSMC's five major customers are chasing orders, indicating that AI applications have blossomed everywhere, and the demand for AI chips from major manufacturers has increased significantly.
The inquiry found that the current CoWoS advanced packaging technology is mainly divided into three kinds -- CoWos-S, CoWoS-R, CoWoS-L, of which CoWoS -L is one of the latest technologies, combining the advantages of CoWoS-S and InFO technology, the use of intermediary layers with LSI (Local Silicon Interconnect) chip Provides a flexible integration solution that can be used for chip-to-chip integration.
Public information shows that NVIDIA is TSMC CoWoS advanced packaging major customers, almost wrapped up 60% of the relevant production capacity, including H100, A100 and other AI chips have applications, and AMD's newest AI chip products are also currently in mass production, is expected to be listed next year, the MI300 chip will be adopted SoIC and CoWoS and other two advanced packaging structure.
In addition, AMD's Xilinx has been a major customer of TSMC's CoWoS advanced packaging. As the demand for AI continues to increase in the future, companies such as Xilinx and Broadcom have also begun to add CoWoS advanced packaging capacity to TSMC.
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