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TSMC's expansion continues to accelerate: it used to build an average of two plants a year, now up to six plants a year

Update time : 2022-09-02 13:00:19

On August 30, the 2022 TSMC Technology Forum was resumed offline at Taipei station. Wang yinglang, deputy general manager of TSMC Fab operations, introduced the progress of TSMC Fab construction and the innovation of intelligent manufacturing at the forum.

Wang yinglang said that TSMC has an excellent record in rapidly expanding production capacity and will do its best to support the business growth of customers. In order to meet the market demand, the speed of TSMC's construction of wafer plants has been increased from two per year from 2017 to 2019 to six per year from 2020 to 2022. The capacity of advanced manufacturing processes is 7, 5 and 3nm. From 2018 to 2022, the compound growth rate will increase by 70%. The capacity of 5nm will be four times that of two years ago. The capacity of special process will be expanded synchronously. The capacity of 12 inch special process will be increased by 14% from 2021 to 2022. TSMC will become the most trusted technology capacity provider.
At the same time, he also said that TSMC continues to improve productivity and maximize output through innovation in intelligent manufacturing. "As a company, TSMC is committed to providing the right capacity at the right time, which is our customer-centric foundation." On this basis, the capital expenditure of TSMC has more than doubled in the past three years, that is, from less than US $15 billion in 2019 to US $30 billion in 2021, and then to about US $40 billion in 2022, to build capacity for advanced processes, mature processes and 3D fabric.
Wang yinglang also stressed that in order to improve the resilience of the supply chain, TSMC continued to expand its global distribution in Arizona, Japan, Kumamoto, Nanjing, and Taiwan. Among them, a wafer factory in Arizona is under construction, and it is expected to produce 5nm process in 2024. Tainan wafer 18 Plant Phase 5-9 is currently under construction and will be a 3nm production base in the future. In addition, TSMC is preparing a 20 wafer plant in Hsinchu, which will be a 2nm production base in the future. At the same time, it plans to build a 22 wafer plant in Kaohsiung to expand the 7Nm and 28nm production capacity.
As for Japan, TSMC is expanding its plant in Kumamoto to provide 12 / 16nm and 28nm family technology wafer manufacturing to meet the strong demand of the global market for special processes. The construction of the wafer factory is in progress and mass production will begin in 2024. Through capacity expansion, TSMC will also increase its special process capacity by nearly 50% in 2025.

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