According to Taiwan Economic Daily News, TSMC, which has the advantage of advanced processes, is also actively laying out the third generation of semiconductors to compete with UMC, World Advanced, and Force Semiconductor.
Foundry four in the operating strategy, not only to reduce the impact of the boom cycle, but also in the 5G RF, artificial intelligence (AI), high-speed computing (HPC), automotive electronics growth trends established, targeting the next wave of industrial growth momentum.
TSMC Chairman Liu Deyin has mentioned that the third-generation semiconductor output value is small, the application side of the automotive field for more, is a special technology, although at this stage still can not be compared with the silicon-based semiconductor, but TSMC's third-generation semiconductor output should still be the largest volume.
The legal person pointed out that TSMC and IDM factories and IC design industry cooperation, the first generation of GaN technology platform on silicon substrate, has been completed last year and further enhanced to support multiple applications, the development of the second generation of GaN technology platform on silicon substrate is expected to be completed this year.
In addition, UMC has invested in the third generation of semiconductors by transferring to UMC. According to analysis, UMC Group and TSMC in the third generation of semiconductor development strategy is not the same, TSMC focus on gallium nitride, the main focus of power semiconductors, UMC is power and microwave and advance.
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