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UMC Partners with Siemens on 3D IC Technology

Update time : 2022-10-07 16:31:08

Siemens Digital Industrial Software recently announced that it will work with foundry UMC to develop 3D IC technology.
Siemens Digital Industrial Software said that the use of stacking technology in a single package component allows for the integration of more functions on the same or smaller chip area. The technology not only saves space, but also enables higher energy efficiency and lower power consumption.

UMC's joint customers with Siemens Digital Industrial Software have increasing demand for applications such as high performance computing, RF and intelligent Internet of Things (AIoT), and the demand for 3D IC solutions has grown accordingly, said T.M. Cheng, vice president of technology development and design support for UMC components. This collaboration between UMC and Siemens will help assist customers in accelerating time-to-market.
As the development cost of advanced process chips below 10nm is very high and the market share is largely dominated by TSMC and Samsung, it is difficult for other manufacturers to be among them. Without sufficient market orders, they often end up with a loss of money. Therefore, UMC, Ge-chip and other manufacturers have said that they have given up the competition for sub-10nm chips. However, this does not mean that UMC, Ge-core and other manufacturers do not have the opportunity to compete with TSMC, Samsung and other leading companies on the same stage. For manufacturers who give up advanced processes, 3D IC technology is the key to find another way and achieve catch-up.
Said the IC industry research center, senior consultant pool Xiannian, said today's chip structure has been developed from two-dimensional (2D) to three-dimensional (3D) stage, the last two years 3D IC technology is gradually active in the chip manufacturing of major enterprises. Compared with traditional 2D chips, 3D IC can realize multi-layer stacking and use stacking or interconnection technology, and other micro-processing technologies to form three-dimensional integration in the Z-axis direction of the chip or structure. As the semiconductor industry chain becomes increasingly sophisticated and new technologies are introduced in various fields, 3D IC manufacturing and packaging technologies will become a key way to improve chip performance in the future.

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