English
Русский
Home
Products
Feedback
About Us
Contact Us
Recycling
Inquiry
English
en
Русский
Inquiry (0)
Home
Products
Feedback
About Us
Contact Us
Recycling
Inquiry
Industry News
Home > Industry News

UMC Launches 40nm RFSOI Platform to Accelerate 5G Millimeter Wave Applications

Views : 14
Update time : 2023-05-06 09:54:39
        UMC recently announced the availability of a 40nm RFSOI process platform for mass production of mmWave RF front-end process products to drive the adoption of 5G wireless networks, including applications in smartphones, FWA systems and small base stations.
        Most 5G networks today transmit in bands below 8GHz, but millimeter wave technology uses bands between 24GHz and 60GHz to provide ultra-high transmission speeds, extremely low latency and more stable connections. UMC's 40nm RFSOI process platform is optimized for RF switches, low-noise amplifiers and power amplifiers to handle a wider millimeter wave band while maintaining a compact size and meeting the need to include more RF components in the millimeter wave module to provide customers with a solution that integrates beamformers, core and passive components and front-end components in a single RF chip.
        Raj Verma, executive director of technology development at UMC, said the development of 5G depends on the deployment of millimeter wave to provide the speed and capability required for VR/AR, smart cities, industrial automation and healthcare applications. With the launch of the 40nm RFSOI platform, UMC is expanding its portfolio of RF technologies to help customers bring their advanced 5G devices to market and capture business opportunities in the continuously growing millimeter wave market. Several customers have already discussed with us to develop customized 40nm RFSOI processes for their RF front-end products, with volume production expected to begin in 2024.
        UMC provides the most complete RF front-end module solutions serving a wide range of market applications including mobile communications, Wi-Fi, automotive, IoT and satellite communications. RFSOI series solutions are manufactured on 8" and 12" wafers. Since 2014, UMC has finalized over 400 products and 35 billion RFSOI ICs for various applications; UMC's 55nm RFSOI process has also been in production for years, serving the 5G sub-8GHz market.

 
Previous :
Next :
Related News
Read More >>
How many chips does a car need? How many chips does a car need?
Sep .19.2024
Automotive chips can be divided into four types according to their functions: control (MCU and AI chips), power, sensors, and others (such as memory). The market is monopolized by international giants. The automotive chips people often talk about refer to
Position and Function of Main Automotive Sensors Position and Function of Main Automotive Sensors
Sep .18.2024
The function of the air flow sensor is to convert the amount of air inhaled into the engine into an electrical signal and provide it to the electronic control unit (ECU). It is the main basis for determining the basic fuel injection volume. Vane type: The
Chip: The increasingly intelligent electronic brain Chip: The increasingly intelligent electronic brain
Sep .14.2024
In this era of rapid technological development, we often marvel at how mobile phones can run various application software smoothly, how online classes can be free of lag and achieve zero latency, and how the functions of electronic devices are becoming mo
LDA100 Optocoupler: Outstanding Performance, Wide Applications LDA100 Optocoupler: Outstanding Performance, Wide Applications
Sep .13.2024
In terms of characteristics, LDA100 is outstanding. It offers AC and DC input versions for optional selection, enabling it to work stably in different power supply environments. The small 6-pin DIP package not only saves space but also facilitates install
Email